发明公开
- 专利标题： ELECTROLYTIC COPPER PLATING SOLUTIONS
- 专利标题（中）： 解镀铜
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申请号： EP03788347.7申请日： 2003-08-08
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公开(公告)号： EP1529126A2公开(公告)日： 2005-05-11
- 发明人: MARTYAK, Nicholas, Michael
- 申请人： Atofina Chemicals, Inc.
- 申请人地址： 2000 Market Street Philadelphia, PA 19103-3222 US
- 专利权人： Atofina Chemicals, Inc.
- 当前专利权人： Atofina Chemicals, Inc.
- 当前专利权人地址： 2000 Market Street Philadelphia, PA 19103-3222 US
- 代理机构： Granet, Pierre
- 优先权： US403954P 20020816; US620042 20030715
- 国际公布： WO2004016829 20040226
- 主分类号： C25D1/00
- IPC分类号： C25D1/00
摘要：
Disclosed are copper electroplating solutions, methods for using the solutions and products formed by using such methods and solutions in which the solutions contain copper alkanesulfonate salts and free alkanesulfonic acids, wherein the free acid has a concentration from about 0.05 to about 2.50 M, and which are intended for the metallization of micron-sized dimensioned trenches or vias, through-holes and microvias.
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