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    SYSTEM AND METHOD FOR PRODUCING SUPERALLOYS UTILIZING ELECTROMETALLURGY
    1.
    发明公开
    SYSTEM AND METHOD FOR PRODUCING SUPERALLOYS UTILIZING ELECTROMETALLURGY 审中-公开

    公开(公告)号：EP4428271A2

    公开(公告)日：2024-09-11

    申请号：EP24158490.3

    申请日：2024-02-19

    申请人： Spirit AeroSystems, Inc.

    发明人： NASSERRAFI, Rahbar ,  HICKS, JR, Gerald Eugene ,  TOIVONEN, Paul Ray ,  LUU, Ni Yen ,  VIERTHALER, Shawn Douglas

    IPC分类号： C25D13/02 ,  C25D1/16 ,  C25D15/02 ,  C25D1/00

    CPC分类号： C25D13/02 ,  C25D1/16 ,  C25D15/02 ,  C25D1/00

    摘要： A system and method for producing a rigid, heat-resistant part, such as a superalloy, via electrodeposition. The method can include the steps of coating a secondary alloy particulate with a superior alloy, forming a pre-coated particulate, dispensing a quantity of the pre-coated particulate into a container of an electrolytic solution, and applying a charge to the electrolytic solution such that the pre-coated particulate is electrodeposited onto a cathode or an external casing of the cathode. The pre-coated particulate can include particulate of non-uniform size and/or shape. The secondary alloy particulate is protected in the catalytic solution by the superior alloy coated thereon, such as nickel, iron, cobalt, and/or copper. The method also includes a step of vibrating or agitating the electrolytic solution before and/or during applying the charge to the electrolytic solution for even distribution of the pre-coated particulate onto the cathode or an external casing thereof.

    PROCESS FOR PRODUCING COPPER FOIL BY ELECTROLYTIC DEPOSITION OF COPPER
    3.
    发明公开
    PROCESS FOR PRODUCING COPPER FOIL BY ELECTROLYTIC DEPOSITION OF COPPER 审中-公开

    公开(公告)号：EP4400634A1

    公开(公告)日：2024-07-17

    申请号：EP23151521.4

    申请日：2023-01-13

    申请人： Atotech Deutschland GmbH & Co. KG

    发明人： Lamprecht, Sven ,  Matejat, Kai-Jens ,  Oezkoek, Akif

    IPC分类号： C25D1/04 ,  C25B9/01 ,  C25C1/12 ,  C25D3/38 ,  C25D1/00

    CPC分类号： C25D3/38 ,  C25D1/04 ,  C25D1/00

    摘要： The invention relates to a process for producing copper foil by electrolytic deposition of copper metal on a rotating drum cathode and, in particular, to the means for dissolving the copper to be deposited in the process. In the process, copper is electrolytically deposited on a rotating drum cathode, which is partially immersed in an electrolyte solution contained in a plating tank; the deposited copper layer is peeled off the part of the drum cathode that is not immersed in the electrolyte solution to obtain the copper foil; an insoluble anode is used as counterelectrode to the drum cathode; the electrolyte solution contains copper ions, organic additives and an Fe2+/Fe3+ redox system; the concentration of copper ions in the electrolyte solution is maintained constant by passing the electrolyte solution through a copper dissolution unit; in the copper dissolution unit, the electrolyte solution is in contact with an auxiliary anode and an auxiliary cathode; copper metal and an oxygen-containing gas are introduced into the copper dissolution unit; the auxiliary anode is in contact with the copper metal; the oxygen-containing gas contacts the surface of the copper metal; the copper metal continuously dissolves into the electrolyte solution by being oxidized by the Fe3+ component of the Fe2+/Fe3+ redox system.

    COLD SPRAYED ELECTRICAL CIRCUITS AND METHODS THEREOF
    7.
    发明公开
    COLD SPRAYED ELECTRICAL CIRCUITS AND METHODS THEREOF 审中-公开

    公开(公告)号：EP4238761A1

    公开(公告)日：2023-09-06

    申请号：EP23159607.3

    申请日：2023-03-02

    申请人： The Boeing Company

    发明人： BRUTON, Eric Alan ,  GAYDOS, Stephen P. ,  ZWEIG, Andrew Michael

    IPC分类号： B32B27/08 ,  B32B27/28 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B27/42 ,  B64C1/00 ,  C23C24/00 ,  C25D1/00

    摘要： The present disclosure relates to a cold spray metal process for providing an electrical connection within a multilayered composite article. The present disclosure relates to a cold sprayed metal coated article or a structural component having a polymeric composite material having at least one surface, a thermoplastic electrochemical insulating layer on the at least one surface, an electrical circuit may include a cold sprayed metal coating present on at least a portion of a surface of the electrochemical insulating layer, and at least one additional layer, the at least one additional layer encapsulating at least a portion of the cold sprayed metal between the additional layer and the electrochemical insulating layer. The structural component may include a cold sprayed metal coating having one or more non-continuous segments, where the one or more non-continuous segments are not in lateral contact with one another.