Method of producing a structure comprising a thin layer of semiconductor material obtained from a wafer (10), the wafer (10) comprising a lattice parameter matching layer (2) comprising an upper layer of semiconductor material having a first lattice parameter, a film (3) of semiconductor material having a nominal lattice parameter substantially different from the first lattice parameter, said grown film (3) being strained by the matching layer (2), a relaxed layer (4) a nominal lattice parameter to substantially identical to the first lattice parameter, the method comprising transfer of the relaxed layer (4) and the strained film (3) to a receiving substrate (5) and enrichment in an element other than silicon of the relaxed layer (4), thus increasing the relaxed layer (4) lattice parameter.