Disclosed is a nozzle arrangement which can be used especially as a gushing nozzle in electroplating plants through which circuit boards penetrate in a horizontal direction. Said nozzle arrangement comprises an elongate housing (2) that is provided with at least one port for supplying a liquid used for treating a workpiece, e.g. a circuit board, and preferably several slit-shaped liquid discharge ports (8) for dispensing the treatment liquid. A liquid duct (5) is embodied inside the housing (2) in order to supply treatment liquid from the liquid supply port to the liquid discharge ports (8). In order to obtain a flow rate of the treatment liquid, which is as constant as possible at the liquid discharge ports (8), (a) the cross section of the passage of the liquid duct (5) for the treatment liquid decreases steadily from the liquid supply port in the longitudinal direction of the housing, and/or (b) an accumulation space is provided upstream of where the liquid leaves the liquid discharge ports (8).