发明公开
- 专利标题： VERFAHREN ZUR NACHBEARBEITUNG EINES DURCHGANGSLOCHS EINES BAUTEILS
- 专利标题（英）： Method for the aftertreatment of a through hole of a component
- 专利标题（中）： 方法完成组件的通路孔
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申请号： EP03785557.4申请日： 2003-12-11
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公开(公告)号： EP1575731A1公开(公告)日： 2005-09-21
- 发明人: BLOCH, Peter , JABADO, Rene , KRÜGER, Ursus , KÖRTVELYESSY, Daniel , REICHE, Ralph , RINDLER, Michael
- 申请人： SIEMENS AKTIENGESELLSCHAFT
- 申请人地址： Wittelsbacherplatz 2 80333 München DE
- 专利权人： SIEMENS AKTIENGESELLSCHAFT
- 当前专利权人： SIEMENS AKTIENGESELLSCHAFT
- 当前专利权人地址： Wittelsbacherplatz 2 80333 München DE
- 优先权： DE10259366 20021218
- 国际公布： WO2004054748 20040701
- 主分类号： B23H9/10
- IPC分类号： B23H9/10 ; B23H9/16
摘要：
In prior art, through holes often have to be after-treated manually. Disclosed is a method allowing through holes (10) to be after-treated in a chemical or electrochemical manner with the aid of a material-removing agent (13, 16, 33), the outer surface (45) located around a discharge port (51) of the through hole (10) being protected accordingly from being attacked by the agent (13, 16, 33) that is to be removed.
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