发明公开
- 专利标题: Plasma uniformity control by gas diffuser hole design
- 专利标题(中): 通过模制气体分布孔的等离子体均匀性的控制
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申请号: EP05000831.7申请日: 2005-01-17
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公开(公告)号: EP1595974A2公开(公告)日: 2005-11-16
- 发明人: Choi, Soo Young , White, John M. , Wang, Qunha , Hou, Li , Kim, Ki Woon , Kurita, Shiniti , Won, Tae Kyung , Anwar, Suhail , Park, Beom Soon , Tiner, Robin L.
- 申请人: APPLIED MATERIALS, INC.
- 申请人地址: 3050 Bowers Avenue Santa Clara, California 95054 US
- 专利权人: APPLIED MATERIALS, INC.
- 当前专利权人: APPLIED MATERIALS, INC.
- 当前专利权人地址: 3050 Bowers Avenue Santa Clara, California 95054 US
- 代理机构: Zimmermann, Gerd Heinrich
- 优先权: US889683 20040712; US570876P 20040512
- 主分类号: C23C16/505
- IPC分类号: C23C16/505 ; H01J37/32 ; C23C16/455
摘要:
Embodiments of a gas diffuser plate for distributing gas in a processing chamber are provided. The gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of the diffuser plate. The gas passages include hollow cathode cavities at the downstream side to enhance plasma ionization. The depths, the diameters, the surface area and density of hollow cathode cavities of the gas passages that extend to the downstream end can be gradually increased from the center to the edge of the diffuser plate to improve the film thickness and property uniformity across the substrate. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can be created by bending the diffuser plate toward downstream side, followed by machining out the convex downstream side. Bending the diffuser plate can be accomplished by a thermal process or a vacuum process. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can also be created computer numerically controlled machining. Diffuser plates with gradually increasing diameters, depths and surface areas of the hollow cathode cavities from the center to the edge of the diffuser plate have been shown to produce improved uniformities of film thickness and film properties.
公开/授权文献
- EP1595974A3 Plasma uniformity control by gas diffuser hole design 公开/授权日:2006-04-05
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