发明授权
- 专利标题： SOLDERING PROCESS USING IMIDAZOLE COMPOUND
- 专利标题（中）： 焊接使用一个咪唑
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申请号： EP04721686.6申请日： 2004-03-18
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公开(公告)号： EP1605078B1公开(公告)日： 2010-07-21
- 发明人: MURAI, Takayuki, c/o Shikoku Chemicals Corp. , KIKUKAWA, Yoshimasa, c/o Shikoku Chemicals Corp. , HIRAO, Hirohiko, c/o Shikoku Chemicals Corp.
- 申请人： SHIKOKU CHEMICALS CORPORATION
- 申请人地址： 8-537-1, Doki-cho Higashi Marugame-shi Kagawa 763-8504 JP
- 专利权人： SHIKOKU CHEMICALS CORPORATION
- 当前专利权人： SHIKOKU CHEMICALS CORPORATION
- 当前专利权人地址： 8-537-1, Doki-cho Higashi Marugame-shi Kagawa 763-8504 JP
- 代理机构： Müller-Boré & Partner Patentanwälte
- 优先权： JP2003075030 20030319; JP2003338527 20030929; JP2004022241 20040129; JP2004028613 20040204
- 国际公布： WO2004083487 20040930
- 主分类号： C23C22/52
- IPC分类号： C23C22/52 ; H05K3/28 ; C07D233/64 ; C23F11/14
摘要：
An aqueous composition for surface treatment of copper or copper alloys is disclosed which enables soldering in which a lead-free solder is used. The aqueous composition contains a compound represented by the following formula (1): (1) (wherein R1 represents a hydrogen atom or a methyl group; and R4 and R5 represent hydrogen atoms when R2 and R3 represent chlorine atoms, while R4 and R5 represent chlorine atoms when R2 and R3 represent hydrogen atoms).
公开/授权文献
- EP1605078A1 NOVEL IMIDAZOLE COMPOUND AND USAGE THEREOF 公开/授权日：2005-12-14
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