公开(公告)号：EP1605078B1

公开(公告)日：2010-07-21

申请号：EP04721686.6

申请日：2004-03-18

申请人： SHIKOKU CHEMICALS CORPORATION

发明人： MURAI, Takayuki, c/o Shikoku Chemicals Corp. ,  KIKUKAWA, Yoshimasa, c/o Shikoku Chemicals Corp. ,  HIRAO, Hirohiko, c/o Shikoku Chemicals Corp.

IPC分类号： C23C22/52 ,  H05K3/28 ,  C07D233/64 ,  C23F11/14

CPC分类号： C07D233/64 ,  B23K35/3615 ,  B23K35/3616 ,  C23C22/52 ,  C23F11/149 ,  H05K3/282 ,  H05K2203/124

摘要： An aqueous composition for surface treatment of copper or copper alloys is disclosed which enables soldering in which a lead-free solder is used. The aqueous composition contains a compound represented by the following formula (1): (1) (wherein R1 represents a hydrogen atom or a methyl group; and R4 and R5 represent hydrogen atoms when R2 and R3 represent chlorine atoms, while R4 and R5 represent chlorine atoms when R2 and R3 represent hydrogen atoms).

公开(公告)号：EP1605078A1

公开(公告)日：2005-12-14

申请号：EP04721686.6

申请日：2004-03-18

申请人： SHIKOKU CHEMICALS CORPORATION

发明人： MURAI, Takayuki, c/o Shikoku Chemicals Corp. ,  KIKUKAWA, Yoshimasa, c/o Shikoku Chemicals Corp. ,  HIRAO, Hirohiko, c/o Shikoku Chemicals Corp.

IPC分类号： C23C22/52 ,  B23K1/19 ,  B23K1/20 ,  C07D233/64

CPC分类号： C07D233/64 ,  B23K35/3615 ,  B23K35/3616 ,  C23C22/52 ,  C23F11/149 ,  H05K3/282 ,  H05K2203/124

摘要： A water-based composition for treating copper or copper alloy surface for lead-free soldering, the composition comprising a compound represented by general formula (1):
wherein R 1 is hydrogen or methyl, and either R 2 and R 3 represent chlorine and R 4 and R 5 represent hydrogen, or R 2 and R 3 represent hydrogen and R 4 and R 5 represent chlorine.