A brazing solder alloy is disclosed, which can particularly be produced as a homogeneous, ductile amorphous brazing solder film, comprising 2 to 20 atom % nickel, 2 to 12 atom % tin, 0.5 to 5.0 atom % zinc, 6 to 16 atom % phosphorus, the remainder copper and incidental impurities. The total proportions of copper, nickel, tin and zinc is between 80 and 95 atom %. An excellent resistance to surface oxidation by air or air humidity is achieved by the addition of more than 0.5 atom % zinc. The above brazing solder alloys permit the production of excellent brazing solder compounds.