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1.发明公开VERFAHREN ZUM HARTLÖTEN UND VERWENDUNG EINER HARTLOTFOLIE ZUM INDUKTIONSLÖTEN 审中-公开VERFAHREN ZUMHARTLÖTENUND VERWENDUNG EINER HARTLOTFOLIE ZUMINDUKTIONSLÖTEN
公开(公告)号：EP3188870A1
公开(公告)日：2017-07-12
申请号：EP15753931.3
申请日：2015-08-18
发明人： HARTMANN, Thomas
IPC分类号： B23K1/00 , B23K1/002 , B23K1/20 , B23K3/047 , B23K35/30 , B23K35/02 , B23K103/04 , B23K103/18
CPC分类号： B23K35/22 , B23K1/0012 , B23K1/002 , B23K1/20 , B23K3/0475 , B23K35/0222 , B23K35/0233 , B23K35/0238 , B23K35/025 , B23K35/0255 , B23K35/30 , B23K35/302 , B23K35/3033 , B23K35/3046 , B23K35/3053 , B23K2201/04 , B23K2203/05 , B23K2203/26 , B29C65/7847 , B32B15/01 , C22C19/05 , C22C19/07 , C22C45/008 , F16L41/02 , F16L41/026 , F16L41/08 , F16L41/084 , F16L58/185
摘要： Disclosed is a hard soldering method wherein an amorphous or partially amorphous hard soldering film having a composition that has a metalloid content of 10 to 30 atomic percent is disposed at a joining point between two or more parts. The hard soldering film has the shape of a wound circular strip that has a short-circuited current path between at least two layers lying on top of one another. The hard soldering film is inductively heated and melted, and a hard soldered joint is created between the parts.
摘要翻译： 公开了一种硬焊接方法，其中具有准金属含量为10至30原子百分比的组成的无定形或部分无定形硬焊料膜设置在两个或更多个部件之间的接合点处。 硬质焊接膜具有缠绕的圆形条带的形状，其在至少两层彼此叠置的层之间具有短路电流路径。 硬钎焊膜被感应加热并熔化，并且在这些部件之间产生硬焊接接头。
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公开(公告)号：EP2683523B1
公开(公告)日：2020-05-06
申请号：EP12717474.6
申请日：2012-03-08
IPC分类号： B23K35/02 , B23K35/30 , C22C1/00 , C22C19/05 , C22C45/04 , B23K35/38 , B23K101/10 , B23K101/14
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3.发明公开HARTLOTFOLIE AUF NICKEL-BASIS, VERFAHREN ZUM HERSTELLEN EINER HARTLOTFOLIE, GEGENSTAND MIT EINER LÖTNAHT UND VERFAHREN ZUM HARTLÖTEN 审中-公开钎焊ON镍基，制造方法硬钎焊板的对象与用于钎焊的钎焊接缝和方法
公开(公告)号：EP2683523A1
公开(公告)日：2014-01-15
申请号：EP12717474.6
申请日：2012-03-08
摘要： The invention relates to an amorphous, ductile Ni-based brazing foil having a composition that essentially comprises NiRemainderCraBbPcSid with 21 atomic percent
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4.发明公开HARTGELÖTETER GEGENSTAND UND VERFAHREN ZUM HARTLÖTEN ZWEIER ODER MEHRERER TEILE 审中-公开钎焊主题和方法钎焊两个或多个部分
公开(公告)号：EP2555899A1
公开(公告)日：2013-02-13
申请号：EP11720184.8
申请日：2011-04-04
CPC分类号： B23K35/304 , B23K1/0012 , B23K1/008 , B23K1/012 , B23K35/0233 , B23K35/025 , B23K35/30 , B23K2201/14 , B23K2203/05 , F28F21/089 , F28F2275/04 , F28F2275/045 , Y10T428/12937 , Y10T428/26 , Y10T428/31678
摘要： The invention relates to a method for brazing two or more parts. A hard solder having a composition consisting of Ni
Rest Cr
a B
b P
c Si
d having 20 atom %-
5.发明授权HARTLOTFOLIE AUF NICKEL-BASIS SOWIE VERFAHREN ZUM HARTLÖTEN 有权HARTLOTFOLIE AUF镍基SOWIE VERFAHREN ZUMHARTLÖTEN
公开(公告)号：EP2203574B8
公开(公告)日：2017-08-16
申请号：EP08855053.8
申请日：2008-10-09
CPC分类号： B23K1/0012 , B23K1/19 , B23K35/0233 , B23K35/3033 , B23K35/304 , C22C1/002 , C22C19/05 , C22C19/058 , C22C45/04 , C22F1/002 , C22F1/10 , C22F3/00 , F02M26/29 , F28F21/083 , F28F21/089 , Y10T428/12944 , Y10T428/12972
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公开(公告)号：EP2203574B1
公开(公告)日：2017-04-26
申请号：EP08855053.8
申请日：2008-10-09
CPC分类号： B23K1/0012 , B23K1/19 , B23K35/0233 , B23K35/3033 , B23K35/304 , C22C1/002 , C22C19/05 , C22C19/058 , C22C45/04 , C22F1/002 , C22F1/10 , C22F3/00 , F02M26/29 , F28F21/083 , F28F21/089 , Y10T428/12944 , Y10T428/12972
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公开(公告)号：EP1651786A1
公开(公告)日：2006-05-03
申请号：EP04762581.9
申请日：2004-08-03
发明人： HARTMANN, Thomas , NÜTZEL, Dieter
摘要： A brazing solder alloy is disclosed, which can particularly be produced as a homogeneous, ductile amorphous brazing solder film, comprising 2 to 20 atom % nickel, 2 to 12 atom % tin, 0.5 to 5.0 atom % zinc, 6 to 16 atom % phosphorus, the remainder copper and incidental impurities. The total proportions of copper, nickel, tin and zinc is between 80 and 95 atom %. An excellent resistance to surface oxidation by air or air humidity is achieved by the addition of more than 0.5 atom % zinc. The above brazing solder alloys permit the production of excellent brazing solder compounds.
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公开(公告)号：EP2203574A1
公开(公告)日：2010-07-07
申请号：EP08855053.8
申请日：2008-10-09
CPC分类号： B23K1/0012 , B23K1/19 , B23K35/0233 , B23K35/3033 , B23K35/304 , C22C1/002 , C22C19/05 , C22C19/058 , C22C45/04 , C22F1/002 , C22F1/10 , C22F3/00 , F02M26/29 , F28F21/083 , F28F21/089 , Y10T428/12944 , Y10T428/12972
摘要： The invention relates to an amorphous, ductile hard solder foil having a composition of substantially NiRestCraBbPcSid with 2 Atom% ≤ a ≤ 30 Atom%; 0.5 Atom% ≤ b ≤ 14 Atom%; 2 Atom% ≤ c ≤ 20 Atom%; 0 Atom% ≤ d ≤ 14 Atom%; incidental impurities of ≤ 0.5 Atom%; remainder Ni, where c > b > c/15 and 10 Atom% ≤ b + c + d ≤ 25 Atom%.
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公开(公告)号：EP1651786B1
公开(公告)日：2009-01-07
申请号：EP04762581.9
申请日：2004-08-03
发明人： HARTMANN, Thomas , NÜTZEL, Dieter
摘要： A brazing solder alloy is disclosed, which can particularly be produced as a homogeneous, ductile amorphous brazing solder film, comprising 2 to 20 atom % nickel, 2 to 12 atom % tin, 0.5 to 5.0 atom % zinc, 6 to 16 atom % phosphorus, the remainder copper and incidental impurities. The total proportions of copper, nickel, tin and zinc is between 80 and 95 atom %. An excellent resistance to surface oxidation by air or air humidity is achieved by the addition of more than 0.5 atom % zinc. The above brazing solder alloys permit the production of excellent brazing solder compounds.
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10.发明公开
公开(公告)号：EP1917120A1
公开(公告)日：2008-05-07
申请号：EP06761819.9
申请日：2006-07-18
发明人： HARTMANN, Thomas , NÜTZEL, Dieter
CPC分类号： B23K31/02 , B23K35/0233 , B23K35/3053 , B23K35/3066 , C21D1/00 , C21D2201/03 , C22C1/002 , C22C19/03 , C22C45/02 , C22C45/04 , C22F1/10 , F28F21/089 , Y10T428/12951 , Y10T428/12958
摘要： An iron-nickel-based brazing foil and a brazing method. An amorphous ductile brazing foil with a composition is produced comprising FeaNibCrcSidBeMOfPg, where 25 ≤ a ≤ 50 atomic %; 25
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