The invention relates to a connection arrangement comprising an outer conductive structure (44), which is at least partially or completely placed inside a recess (37) of an electrically non-conductive insulating layer (34, 36). At the bottom of the recess (37), an inner conductive structure (22) is placed on one side of the insulating layer (34, 36) and, in a contacting area, it borders on the outer conductive structure (44). A contact surface is placed on the outer conductive structure (44) on the other side of the recess (37). The contacting area and the contact surface do not overlap one another or only in part. The bottom of the recess (37) is, when viewed in the normal direction, arranged in such at manner that it overlaps at least half of the contact surface or the entirety thereof so that a step in the insulating layer (34, 36) is situated on the edge of the recess (37) outside of a main current path extending between the contact surface and the inner conductive structure (22).