发明公开
- 专利标题： MODULE WITH INTERCHANGEABLE CARD
- 专利标题（中）： 有可拆卸卡模块
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申请号： EP04819053.2申请日： 2004-11-03
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公开(公告)号： EP1687990A1公开(公告)日： 2006-08-09
- 发明人: CLARK, Gordon, P. , MATTSON, Loren, J.
- 申请人： ADC Telecommunications, Inc.
- 申请人地址： 13625 Technology Drive Eden Prairie, MN 55344-2252 US
- 专利权人： ADC Telecommunications, Inc.
- 当前专利权人： ADC Telecommunications, Inc.
- 当前专利权人地址： 13625 Technology Drive Eden Prairie, MN 55344-2252 US
- 代理机构： Bohnenberger, Johannes
- 优先权： US714583 20031113
- 国际公布： WO2005051006 20050602
- 主分类号： H04Q1/14
- IPC分类号： H04Q1/14 ; H05K7/14
摘要：
A patch panel system including a chassis and a plurality of modules. The chassis includes elongated structures configured to interconnect top, bottom and side portions of the chassis. The elongated structures are also configured to receive and secure a printed circuit board and the plurality of modules to the chassis. The modules include a housing and a module card. The card can include a variety of connections that provide communication to connections located on a back plane of the chassis. The system can include a combination of passive and active modules that are interchangeable to provide a variety of interface configurations.
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