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7 条记录 (耗时 0.013 秒)

    MODULE WITH INTERCHANGEABLE CARD
    2.
    发明公开
    MODULE WITH INTERCHANGEABLE CARD 审中-公开
    有可拆卸卡模块

    公开(公告)号：EP1687990A1

    公开(公告)日：2006-08-09

    申请号：EP04819053.2

    申请日：2004-11-03

    申请人： ADC Telecommunications, Inc.

    发明人： CLARK, Gordon, P. ,  MATTSON, Loren, J.

    IPC分类号： H04Q1/14 ,  H05K7/14

    CPC分类号： H04Q1/03 ,  H04Q1/13 ,  H04Q2201/10 ,  H04Q2201/12 ,  H04Q2201/16 ,  H05K7/1448

    摘要： A patch panel system including a chassis and a plurality of modules. The chassis includes elongated structures configured to interconnect top, bottom and side portions of the chassis. The elongated structures are also configured to receive and secure a printed circuit board and the plurality of modules to the chassis. The modules include a housing and a module card. The card can include a variety of connections that provide communication to connections located on a back plane of the chassis. The system can include a combination of passive and active modules that are interchangeable to provide a variety of interface configurations.

    OPTICAL ASSEMBLIES WITH MANAGED CONNECTIVITY
    3.
    发明公开
    OPTICAL ASSEMBLIES WITH MANAGED CONNECTIVITY 审中-公开
    具有管理连接性的光学组件

    公开(公告)号：EP2954358A1

    公开(公告)日：2015-12-16

    申请号：EP14749636.8

    申请日：2014-02-05

    申请人： ADC Telecommunications Inc. ,  Tyco Electronics UK Ltd.

    发明人： MARCOUILLER, Thomas ,  TAYLOR, Chris, Charles ,  PFARR, John, T. ,  BOLSTER, Kristofer ,  BRAN DE LEON, Oscar, Fernando ,  MATTSON, Loren, J.

    IPC分类号： G02B6/42 ,  G02B6/36

    摘要： An adapter block assembly includes an adapter block, a circuit board arrangement, and a cover attached to the adapter block so that the circuit board arrangement is held to the adapter block by the cover. Contact assemblies can be disposed between the adapter block and the circuit board arrangement. The cover can be latched, heat staked, or otherwise secured to the adapter block. Each component of the adapter block assembly can include one or more parts (e.g., multiple adapter blocks, multiple circuit boards, and/or multiple cover pieces).

    摘要翻译： 适配器块组件包括适配器块，电路板装置和附接到适配器块的盖，使得电路板装置通过盖保持到适配器块。 触点组件可以布置在适配器块和电路板布置之间。 盖可以被锁定，热熔或以其他方式固定到适配器块。 适配器块组件的每个部件可以包括一个或多个部件（例如，多个适配器块，多个电路板和/或多个覆盖件）。

    POWER SOURCING UNIT FOR POWER OVER ETHERNET SYSTEM
    6.
    发明公开
    POWER SOURCING UNIT FOR POWER OVER ETHERNET SYSTEM 审中-公开
    动力源FIND UNIT FOR以太网供电系统

    公开(公告)号：EP1751915A1

    公开(公告)日：2007-02-14

    申请号：EP05746997.5

    申请日：2005-05-09

    申请人： ADC Telecommunications, Inc.

    发明人： ANDERSON, John ,  CLARK, Gordon, P. ,  MATTSON, Loren, J. ,  JOHNSON, Steve

    IPC分类号： H04L12/10

    CPC分类号： H04L12/10 ,  G06F2221/2129

    摘要： A power sourcing unit (100) for a power over ethernet system. The unit includes a chassis with a power supply guide and a CPU guide, and a power supply (210) including a power supply connector. The unit also includes a printed circuit board (310) including first and second connectors and being coupled to a plurality of RJ-45 jacks, and a CPU line card (410) including a CPU connector. The power supply guide engages the power supply to allow the power supply to be slid into and out of the unit to couple the power supply connector (215) to the first connector of the printed circuit board (315). The CPU guide engages the CPU line card to allow the CPU line card to be slid into and out of the unit to couple the CPU connector (415) to the second connector of the printed circuit board (317). The CPU line card allows the unit to be coupled to a network. Multiple power sourcing units can be daisy-chained together.

    PATCH PANEL CHASSIS
    7.
    发明公开
    PATCH PANEL CHASSIS 审中-公开
    机箱在面板

    公开(公告)号：EP1688023A2

    公开(公告)日：2006-08-09

    申请号：EP04800729.8

    申请日：2004-11-03

    申请人： ADC Telecommunications, Inc.

    发明人： CLARK, Gordon, P. ,  MATTSON, Loren, J.

    IPC分类号： H05K7/14

    CPC分类号： H05K7/1425 ,  Y10T29/49826

    摘要： A patch panel system including a chassis and a plurality of modules. The chassis includes elongated structures configured to interconnect top, bottom and side portions of the chassis. The elongated structures are also configured to receive and secure a printed circuit board and the plurality of modules to the chassis. The modules include a housing and a module card. The card can include a variety of connections that provide communication to connections located on a back plane of the chassis. The system can include a combination of passive and active modules that are interchangeable to provide a variety of interface configurations.