The invention relates to a method for aligning two flat substrates with one another each having at least one aligning mark for mutual alignment, particularly for aligning a mark with a wafer before exposure. This method comprises a first aligning step in which both substrates are aligned by optically determining the position of the aligning mark of the first substrate, the position of the first substrate is stored, and the second substrate is displaced parallel to the first substrate so that the adjusting mark of the second substrate corresponds with the stored position of the aligning mark of the first substrate. In a second aligning step, the alignment is verified and a fine adjustment is carried out if necessary. In this second step, the aligning marks of both substrates are observed, in essence, simultaneously, and both substrates are aligned with one another by a relative movement parallel to the substrate plane.