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    THIN WAFER CARRIER
    1.
    发明公开
    THIN WAFER CARRIER 有权
    薄晶圆CARRIER

    公开(公告)号：EP2534677A2

    公开(公告)日：2012-12-19

    申请号：EP11742666.8

    申请日：2011-02-08

    申请人： Süss Microtec Lithography GmbH

    发明人： HURLEY, Daniel ,  GEORGE, Gregory

    IPC分类号： H01L21/677 ,  H01L21/673 ,  H01L21/687 ,  B23Q3/08

    摘要： An improved wafer carrier device for carrying and holding semiconductor wafers that have a thickness of below 100 micrometers includes a transportable wafer chuck having an enclosed vacuum reservoir and a top surface configured to support a wafer. The top surface has one or more through-openings extending from the top surface to the vacuum reservoir and the wafer is held onto the top surface via vacuum from the vacuum reservoir drawn through the through-openings.

    Illumination system for a microlithographic contact and proximity exposure apparatus
    2.
    发明公开
    Illumination system for a microlithographic contact and proximity exposure apparatus 审中-公开
    用于微光刻接触和接近曝光设备的照明系统

    公开(公告)号：EP2253997A2

    公开(公告)日：2010-11-24

    申请号：EP09169158.4

    申请日：2009-09-01

    申请人： Süss MicroTec Lithography GmbH

    发明人： Völkel, Reinhard ,  Vogler, Uwe ,  Bich, Andreas ,  Weible, Kenneth J. ,  Eisner, Martin ,  Hornung, Michael ,  Kaiser, Paul ,  Zoberbier, Ralph ,  Cullmann, Elmar

    IPC分类号： G03F7/20

    CPC分类号： G03F7/7035 ,  G03F7/7005 ,  G03F7/70075 ,  G03F7/70566

    摘要： An illumination system for a micro-lithographic contact and proximity exposure apparatus comprising a light source (1), a collector (2), two optical integrators (3,6), two Fourier lenses (4,7), at least one angle defining element (5); and at least one field lens (8). The first optical integrator (3) comprises optical sub-elements and produces a plurality of secondary light sources (6a) each emitting a light bundle. A first Fourier lens (7) effects a superposition of the light bundles and uniform irradiance in its Fourier plane (4a). The second optical integrator (6) is located at the Fourier plane (7a) of the first Fourier lnes (7), comprises optical sub-elements and produces a plurality of tertiary light sources (6a) each emitting a light bundle. A second Fourier lens (7) effects a superposition of the light bundles, uniform irradiance and a desired and uniform angular distribution of light illuminating a mask (9) for contact or proximity lithographic printing. The field lens (8) in the Fourier plane (7a) ensures telecentric illumination the mask (9). The optional field lens (12) in the Fourier plane (4a) of the first optical integrator (3) ensures telecentric illumination of the second optical integrator (6). The angle defining element (5) comprises optical sub-elements and defines the angular distribution of the light illuminating the mask (9). A change of the position of the second Fourier lens (7) or the use of a Fourier zoom lens (62) or hybrid Fourier lens (63) allows run-out control (registration error correction) of the lateral dimensions of the printed miniature pattern in the resist layer on the surface of the wafer (10).

    摘要翻译： 一种用于微光刻接触和接近曝光装置的照明系统，包括光源（1），集光器（2），两个光学积分器（3,6），两个傅立叶透镜（4,7），至少一个角度限定 元素（5）; 和至少一个场镜（8）。 第一光学积分器（3）包括光学子元件并且产生多个发射光束的二级光源（6a）。 第一傅立叶透镜（7）在其傅立叶平面（4a）中实现光束的叠加和均匀的辐照度。 第二光学积分器（6）位于第一傅立叶单元（7）的傅立叶平面（7a）处，包括光学子元件并且产生多个发射光束的多个第三光源（6a）。 第二傅立叶透镜（7）实现光束的叠加，均匀的辐照度以及照射用于接触或邻近平版印刷的掩模（9）的期望且均匀的角度分布。 傅立叶平面（7a）中的场透镜（8）确保掩模（9）的远心照明。 第一光学积分器（3）的傅立叶平面（4a）中的可选的场透镜（12）确保第二光学积分器（6）的远心照明。 角度限定元件（5）包括光学子元件并且限定照射面罩（9）的光的角度分布。 第二傅立叶透镜（7）的位置或使用傅里叶变焦透镜（62）或混合傅立叶透镜（63）的改变允许印刷的微型图案的横向尺寸的偏斜控制（配准误差校正） 在晶片（10）表面上的抗蚀剂层中。

    DIREKTE JUSTIERUNG IN MASKALIGNERN
    3.
    发明公开
    DIREKTE JUSTIERUNG IN MASKALIGNERN 有权
    直接调谐MASKALIGNERN

    公开(公告)号：EP1700169A1

    公开(公告)日：2006-09-13

    申请号：EP04803270.0

    申请日：2004-11-25

    申请人： Süss MicroTec Lithography GmbH

    发明人： HÜLSMANN, Thomas, Dr. ,  HAENEL, Wolfgang ,  STIEVENARD, Philippe

    IPC分类号： G03F9/00

    CPC分类号： G03F9/7038

    摘要： The invention relates to a method for aligning two flat substrates with one another each having at least one aligning mark for mutual alignment, particularly for aligning a mark with a wafer before exposure. This method comprises a first aligning step in which both substrates are aligned by optically determining the position of the aligning mark of the first substrate, the position of the first substrate is stored, and the second substrate is displaced parallel to the first substrate so that the adjusting mark of the second substrate corresponds with the stored position of the aligning mark of the first substrate. In a second aligning step, the alignment is verified and a fine adjustment is carried out if necessary. In this second step, the aligning marks of both substrates are observed, in essence, simultaneously, and both substrates are aligned with one another by a relative movement parallel to the substrate plane.

    Method and apparatus for preventing the deformation of a substrate supported at its edge area
    7.
    发明公开
    Method and apparatus for preventing the deformation of a substrate supported at its edge area 审中-公开
    用于防止在边缘区域的基板gestütztenen的变形的方法和装置

    公开(公告)号：EP2905807A1

    公开(公告)日：2015-08-12

    申请号：EP14162346.2

    申请日：2014-03-28

    申请人： Süss Microtec Lithography GmbH

    发明人： Bogner, Bernhard

    IPC分类号： H01L21/67 ,  H01L21/683

    CPC分类号： H01L21/6838 ,  B25J15/0014 ,  H01L21/67288

    摘要： The method and the apparatus prevents the deformation of a substrate, e.g. a wafer, supported with its edge area or periphery at a support or chuck, and also avoids the damage and/or contamination of the active area of the substrate. In particular, the substrate is mechanically supported at its peripheral or edge portion, namely in the non-active area of the substrate, only; an additional non-mechanical extended support is provided in the active area by means of a gas cushion. The gas cushion is generated by means of a controllable nozzle or purge for a distinct and controlled compensation of the downward deflection of the substrate (Fig. 1).

    摘要翻译： 该方法和装置防止一个基片的变形，E.G. 的晶片，在一支承件或卡盘，其边缘区域或周边支撑，并因此避免在基板的有效区域的损坏和/或污染。 特别地，底物被机械地在其周边或边缘部分支撑，即在衬底的非有源区，只; 的附加的非机械扩展支持在有源区域由气垫来提供。 气垫由可控喷嘴或净化的装置，用于在基板的向下偏转（图1）的不同的且控制的补偿产生的。

    Chuck, in particular for use in a mask aligner
    8.
    发明公开
    Chuck, in particular for use in a mask aligner 审中-公开
    用于对准掩模记录装置，特别是用于在装置

    公开(公告)号：EP2752870A1

    公开(公告)日：2014-07-09

    申请号：EP13150260.1

    申请日：2013-01-04

    申请人： Süss Microtec Lithography GmbH

    发明人： Hansen, Sven ,  Hülsmann, Thomas ,  Schindler, Katrin

    IPC分类号： H01L21/68 ,  G03F9/00

    CPC分类号： H01L21/682 ,  G03F9/703 ,  H01L21/6833

    摘要： The chuck for aligning a first planar substrate, e.g. a wafer, in parallel to a second planar substrate, e.g. a mask, comprises: a top plate having a top surface for arrangement of the first planar substrate, a bottom plate, at least one distance measuring sensor configured to measure a distance between the top surface of the top plate and a surface of the second planar substrate, and at least three linear actuators in contact with the top plate and the bottom plate. The method for setting a gap between a first planar substrate, e.g. a wafer, on a top plate of a chuck, and a second planar substrate, e.g. a mask, in particular by means of the chuck comprises the steps of measuring the thickness of the first planar substrate at at least one point; measuring the distance between a surface of the second planar substrate and the top surface of the top plate by at least one distance measuring sensor of the chuck; and adjusting the tilt between a top surface of the first planar substrate or the chuck and the surface of the second planar substrate by using at least three linear actuators of the chuck, preferably in combination with at least three spring bearings of the chuck.

    摘要翻译： 用于对准的第一平面基材，例如卡盘 的晶片，在平行于第二平面基材，例如 掩模，包括：具有用于第一平面衬底的结构的顶表面上的顶板，底板，至少一个距离测量传感器，配置成测量所述顶板的上表面和所述第二平面的表面之间的距离 基板，并且在与顶板和底板接触的至少三个线性致动器。 用于设置第一平面基板之间的间隙，E.G.的方法 晶片，在卡盘的顶板，和一个第二平面基材，例如 掩模，特别是通过所述卡盘的装置包括测量在至少一个点处的第一平面基底的厚度的步骤; 测量所述第二平面基底的表面，并通过所述卡盘的至少一个距离测量传感器的顶板的顶表面之间的距离; 并且通过使用该卡盘的至少三个线性致动器，优选地与所述卡盘的至少三个弹簧轴承调整第一平面衬底的顶表面或所述卡盘和所述第二平面衬底的表面之间的倾斜。

    IMPROVED DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS
    9.
    发明公开
    IMPROVED DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS 有权
    改进分离装置和方法进行更换临时晶片的BOUND

    公开(公告)号：EP2559057A2

    公开(公告)日：2013-02-20

    申请号：EP11769635.1

    申请日：2011-04-15

    申请人： Süss Microtec Lithography GmbH ,  George, Gregory

    发明人： GEORGE, Gregory

    IPC分类号： H01L21/20

    CPC分类号： B32B43/006 ,  B32B38/1858 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67103 ,  H01L21/67132 ,  H01L21/68 ,  H01L21/6835 ,  H01L21/6838 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381

    摘要： A debonder apparatus for debonding a temporary bonded wafer pair includes a chuck assembly, a flex plate assembly, a contact roller and a resistance roller. The chuck assembly includes a chuck and a first wafer holder configured to hold a first wafer of the temporary bonded wafer pair in contact with a top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold a second wafer of the temporary bonded wafer pair in contact with a first surface of the flex plate. The flex plate is configured to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a first edge of the chuck and includes means for pushing and lifting up a first edge of the flex plate. The resistance roller includes means for traversing horizontally over the flex plate and means for applying a downward force upon the flex plate. The contact roller pushes and lifts up the first edge of the flex plate while the resistance roller simultaneously applies the downward force upon the flex plate and traverses horizontally away from the first edge of the flex plate and thereby the temporary bonded wafer pair delaminates along a release layer and the first and second wafers are separated from each other.