发明授权
- 专利标题： METHOD FOR GLUING A CIRCUIT COMPONENT TO A CIRCUIT BOARD
- 专利标题（中）： 方法用于连接的电路元件与电路板
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申请号： EP05707759.6申请日： 2005-01-10
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公开(公告)号： EP1704761B1公开(公告)日： 2007-11-07
- 发明人: KONRATH, Willibald , SCHOLL, Klaus , SCHMELCHER, Haiko , MULLER, Ulf
- 申请人： Ericsson AB
- 申请人地址： Torshamnsgaten 23 Stockholm SE
- 专利权人： Ericsson AB
- 当前专利权人： Ericsson AB
- 当前专利权人地址： Torshamnsgaten 23 Stockholm SE
- 代理机构： Stasiewski, Piotr Grzegorz
- 优先权： DE102004002274 20040116
- 国际公布： WO2005069714 20050728
- 主分类号： H05K13/04
- IPC分类号： H05K13/04
摘要：
For gluing a circuit component (17) to a circuit board (1), at first at least one fore-running adhesive dot (14) is placed within a contact area (2) between the circuit component (17) and the circuit board (1), then adhesive dots (4) are placed in a regular pattern, and finally the adhesive dots (4) are brought to merge by pressing the circuit component (17) and the circuit board (1) against each other.
公开/授权文献
- EP1704761A1 METHOD FOR GLUING A CIRCUIT COMPONENT TO A CIRCUIT BOARD 公开/授权日：2006-09-27
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