发明公开
EP1716587A2 PROCESS AND APPARATUS FOR REMOVING RESIDUES FROM SEMICONDUCTOR SUBSTRATES
审中-公开
工艺和装置去除残余物从半导体基片
- 专利标题： PROCESS AND APPARATUS FOR REMOVING RESIDUES FROM SEMICONDUCTOR SUBSTRATES
- 专利标题（中）： 工艺和装置去除残余物从半导体基片
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申请号： EP05723478.3申请日： 2005-02-15
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公开(公告)号： EP1716587A2公开(公告)日： 2006-11-02
- 发明人: FULTON, John, L. , GASPAR, Daniel, J. , YONKER, Clement, R. , YOUNG, James, S. , SCOTT, Alan, Lea , ENGELHARD, Mark, H.
- 申请人： BATTELLE MEMORIAL INSTITUTE
- 申请人地址： Pacific Northwest Division, Intellectual Property Services, P.O. Box 999 Richland, WA 99352 US
- 专利权人： BATTELLE MEMORIAL INSTITUTE
- 当前专利权人： BATTELLE MEMORIAL INSTITUTE
- 当前专利权人地址： Pacific Northwest Division, Intellectual Property Services, P.O. Box 999 Richland, WA 99352 US
- 代理机构： Brown, Fraser Gregory James
- 优先权： US783249 20040219
- 国际公布： WO2005081289 20050901
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
The present invention generally relates to a system for cleaning substrates. More particularly, the present invention relates to process(es) for effecting chemical removal of residues from semiconductor substrates, including silicon wafers, using a system of reactive reverse micelle(s) or microemulsions in a densified carbon dioxide matrix. Various reactive chemical agents in the reactive micelle system may be used to effect cleaning and removal of etch and metal residues to levels sufficient for commercial wafer production and processing.
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