发明公开
EP1750306A1 Electronic package having underfill standoff and method
审中-公开
ElektonikgehäusemitUnterfüllungsabstandshalterund Verfahren
- 专利标题： Electronic package having underfill standoff and method
- 专利标题（中）： ElektonikgehäusemitUnterfüllungsabstandshalterund Verfahren
-
申请号： EP06076348.9申请日： 2006-07-03
-
公开(公告)号： EP1750306A1公开(公告)日： 2007-02-07
- 发明人: Myers, Bruce A. , Ihms, David W. , Oman, Todd P.
- 申请人： Delphi Technologies, Inc.
- 申请人地址： P.O. Box 5052 Troy, Michigan 48007 US
- 专利权人： Delphi Technologies, Inc.
- 当前专利权人： Delphi Technologies, Inc.
- 当前专利权人地址： P.O. Box 5052 Troy, Michigan 48007 US
- 代理机构： Denton, Michael John
- 优先权： US198444 20050805
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/56
摘要：
An electronic package (10) having a controlled standoff height between a surface mount device (16) and a circuit board (12). The electronic package (10) includes a circuit board (12) having a substrate and circuitry including mounting pads (14) and a surface mount device (16) having circuitry and contact terminals (18). Solder joints (20) connect the contact terminals (18) of the surface mount device (16) to the mounting pads (14) on the circuit board (12). A dielectric underfill (22) is disposed between the circuit board (12) and the surface mount device (16), and a plurality of filler particles (24) are disposed in the underfill material (22) to provide a separation distance between the circuit board (12) and the surface mount device (16).
信息查询
IPC分类:
