发明公开
- 专利标题： Heat Spreaders with Vias
- 专利标题（中）： 散热器与通孔
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申请号： EP06112212.3申请日： 2006-04-04
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公开(公告)号： EP1783833A3公开(公告)日： 2009-01-21
- 发明人: Reis, Bradley E. , Laser, Brian J. , Smalc, Martin David
- 申请人： GrafTech International Holdings Inc.
- 申请人地址： 12900 Snow Road Parma, OH 44130 US
- 专利权人： GrafTech International Holdings Inc.
- 当前专利权人： GrafTech International Holdings Inc.
- 当前专利权人地址： 12900 Snow Road Parma, OH 44130 US
- 代理机构： Smaggasgale, Gillian Helen
- 优先权： US267933 20051104; US339338 20060125
- 主分类号： H01L23/367
- IPC分类号： H01L23/367 ; H01L23/373 ; H01L21/48
摘要：
Constructions for and methods of manufacturing graphite heat spreaders having thermal vias placed therethrough are provided. Thermal vias having one or two flanges are disclosed, as are flush thermal vias. Graphite heat spreaders having surface layers covering the graphite material are provided. Graphite heat spreaders having a layer of cladding for increased structural integrity are provided. Also disclosed are methods of co-forging a graphite heat spreader element with a metal thermal via in place therein.
公开/授权文献
- EP1783833A2 Heat Spreaders with Vias 公开/授权日：2007-05-09
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