发明公开
- 专利标题： Circuit board and production method therefor
- 专利标题（中）： 印刷电路板和过程及其制备
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申请号： EP07007228.5申请日： 2002-01-10
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公开(公告)号： EP1798767A3公开(公告)日： 2010-04-21
- 发明人: Okada, Kazuo , Hirano, Koichi, c/o Matsushita el. Ind. Co., Ltd. , Okawa, Takaaki , Tanaka, Shinya, c/o Matsushita El. Ind. Co., Ltd.
- 申请人： Panasonic Corporation
- 申请人地址： 1006, Oaza Kadoma Kadoma-shi Osaka 571-8501 JP
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： 1006, Oaza Kadoma Kadoma-shi Osaka 571-8501 JP
- 代理机构： Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
- 优先权： JP2001003312 20010111; JP2001003313 20010111
- 主分类号： H01L25/04
- IPC分类号： H01L25/04 ; H01L23/12 ; H01L23/50 ; H01L23/498 ; H05K3/04 ; H05K3/20
摘要：
A lead frame of a circuit board is punched in a direction opposite to a heat sink plate. Even if burrs are produced due to the punching, the burrs do not penetrate a sheet or short-circuit to the heat sink plate. A resist film tightly contacts on the periphery of a land of the lead frame of the circuit board, and a plated layer tightly contacts on the land. This prevents electronic components from defective mounting on the land.
公开/授权文献
- EP1798767A2 Circuit board and production method therefor 公开/授权日：2007-06-20
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