发明公开
EP1831793A1 METHOD AND APPARATUS TO COUPLE A MODULE TO A MANAGEMENT CONTROLLER ON AN INTERCONNECT 有权
方法和装置用于链接模块,管理控制上的互连

  • 专利标题: METHOD AND APPARATUS TO COUPLE A MODULE TO A MANAGEMENT CONTROLLER ON AN INTERCONNECT
  • 专利标题(中): 方法和装置用于链接模块,管理控制上的互连
  • 申请号: EP05854739.9
    申请日: 2005-12-20
  • 公开(公告)号: EP1831793A1
    公开(公告)日: 2007-09-12
  • 发明人: GUTHRIE, LawsonSUMMERS, MarkDENIES, StevenCAMPINI, Edoardo
  • 申请人: Intel Corporation
  • 申请人地址: 2200 Mission College Boulevard Santa Clara, CA 95052 US
  • 专利权人: Intel Corporation
  • 当前专利权人: Intel Corporation
  • 当前专利权人地址: 2200 Mission College Boulevard Santa Clara, CA 95052 US
  • 代理机构: Dunlop, Hugh Christopher
  • 优先权: US27142 20041229
  • 国际公布: WO2006071625 20060706
  • 主分类号: G06F13/40
  • IPC分类号: G06F13/40
METHOD AND APPARATUS TO COUPLE A MODULE TO A MANAGEMENT CONTROLLER ON AN INTERCONNECT
摘要:
Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.
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