发明公开
EP1864249A1 METHOD FOR MAKING ADVANCED SMART CARDS WITH INTEGRATED ELECTRONICS USING ISOTROPIC THERMOSET ADHESIVE MATERIALS WITH HIGH QUALITY EXTERIOR SURFACES 有权
用于生产非接触式芯片卡集成电子元件使用各向同性的热固化粘结材料提供高品质的室外表面上并生产芯片卡

  • 专利标题: METHOD FOR MAKING ADVANCED SMART CARDS WITH INTEGRATED ELECTRONICS USING ISOTROPIC THERMOSET ADHESIVE MATERIALS WITH HIGH QUALITY EXTERIOR SURFACES
  • 专利标题(中): 用于生产非接触式芯片卡集成电子元件使用各向同性的热固化粘结材料提供高品质的室外表面上并生产芯片卡
  • 申请号: EP05729405.0
    申请日: 2005-03-23
  • 公开(公告)号: EP1864249A1
    公开(公告)日: 2007-12-12
  • 发明人: REED, Paul
  • 申请人: Cardxx, Inc
  • 申请人地址: 1555 West Thomas Avenue Englewood, CO 80110 US
  • 专利权人: Cardxx, Inc
  • 当前专利权人: Cardxx, Inc
  • 当前专利权人地址: 1555 West Thomas Avenue Englewood, CO 80110 US
  • 代理机构: Bradford, Victoria Sophie
  • 国际公布: WO2006101493 20060928
  • 主分类号: G06K19/06
  • IPC分类号: G06K19/06
METHOD FOR MAKING ADVANCED SMART CARDS WITH INTEGRATED ELECTRONICS USING ISOTROPIC THERMOSET ADHESIVE MATERIALS WITH HIGH QUALITY EXTERIOR SURFACES
摘要:
Advanced Smart Cards and similar form factors (e.g. documents, tags) having high quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), synthetic paper or other suitable material can be made with highly sophisticated electronic components (e.g. Integrated Circuit chips, batteries, microprocessors, Light Emitting Diodes, Liquid Crystal Displays, polymer dome switches, and antennae), integrated in the bottom layer of the card structure, through use of injection molded thermosetting or thermoplastic material that becomes the core layer of said Advanced Smart Cards. A lamination finishing process can provide a high quality lower surface, and the encapsulation of the electronic components in the thermosetting or thermoplastic material provides protection from the lamination heat and pressure.
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