发明公开
EP1881747A1 Printed circuit board and electronic device having the same
审中-公开
Leiterplatte und elektronische Vorrichtung damit
- 专利标题: Printed circuit board and electronic device having the same
- 专利标题(中): Leiterplatte und elektronische Vorrichtung damit
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申请号: EP07012749.3申请日: 2007-06-29
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公开(公告)号: EP1881747A1公开(公告)日: 2008-01-23
- 发明人: Lee, Hyun-Su , Lee, Byoung-Jun
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: 416, Maetan-dong Yeongtong-gu Suwon-city Gyeonggi-do 442-742 KR
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: 416, Maetan-dong Yeongtong-gu Suwon-city Gyeonggi-do 442-742 KR
- 代理机构: Dr. Weitzel & Partner
- 优先权: KR20060064305 20060710
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K9/00 ; G02F1/13
摘要:
A driving element and a wiring section electrically connected to the driving element are formed on a base substrate. A first ground pattern outputting a reference voltage of the driving element is formed on the base substrate. The base substrate includes a second ground pattern which is spaced apart from the first ground pattern. An external connection section is included on the base substrate, the external connection section being connected to the first and second ground patterns. A connecting cable contacts the external connection section to permit the first and second ground patterns to be connected to external circuitry.
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