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    CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
    2.
    发明公开
    CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD 审中-公开

    公开(公告)号：EP4513546A1

    公开(公告)日：2025-02-26

    申请号：EP23791815.6

    申请日：2023-04-17

    Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Materials Co., Ltd.

    Inventor： UENO, Toshihide

    IPC: H01L23/12 ,  H01L23/13 ,  H01L23/36 ,  H05K1/02 ,  H05K7/20

    Abstract: A ceramic circuit board according to an embodiment comprises a ceramic substrate and metal sheets joined to either surface of the ceramic substrate. At least one of the metal sheets joined to either surface of the ceramic substrate is a cooling path metal sheet having a cooling path part. The thickness of the ceramic substrate is preferably less than the thickness of the cooling path metal sheet. It is preferable that the ceramic substrate comprises a first ceramic substrate and a second ceramic substrate which is joined to a metal sheet joined to the first ceramic substrate, wherein one surface of the second ceramic substrate is joined to a cooling path metal sheet joined to the first ceramic substrate, and a metal sheet is joined to the other surface of the second ceramic substrate.

    SHIELDING A BENDING PORTION OF A FLEXIBLE DISPLAY
    4.
    发明公开
    SHIELDING A BENDING PORTION OF A FLEXIBLE DISPLAY 审中-公开

    公开(公告)号：EP4482130A3

    公开(公告)日：2025-02-26

    申请号：EP24203984.0

    申请日：2018-11-27

    Applicant: GOOGLE LLC

    Inventor： QI, Qi ,  CHOI, Wonjae ,  TAO, Yi

    IPC: G06F1/16 ,  H04M1/02 ,  H05K1/02

    Abstract: Methods, systems, and apparatus, for shielding a bending portion of a flexible display that can be incorporated in electronic devices. One of the apparatus includes a cover glass element; a driver integrated circuit (D-IC); a mandrel portion; a shaft portion; a panel, positioned between the cover glass element and the D-IC, and comprising an inner panel layer that wraps around at least a portion of the mandrel portion to form a bending portion of the panel, the panel attached on either side on the shaft portion; and a shielding layer positioned around the inner panel layer and configured to inhibit electromagnetic signals through the bending portion.

    DISPLAY DEVICE
    5.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号：EP4472365A3

    公开(公告)日：2025-02-26

    申请号：EP24207730.3

    申请日：2021-03-08

    Applicant: Samsung Electronics Co., Ltd

    Inventor： JANG, Hyukjun ,  LEE, Kyehoon

    IPC: G02F1/13357 ,  H05K1/02 ,  H05K3/28 ,  H10H20/855

    Abstract: Provided is a light apparatus including: a reflective sheet in which a hole is formed; and a light source module exposed through the hole. The light source module may include a board aligned in parallel with the reflective sheet, wherein a first surface of the board is toward the reflective sheet, a light emitting diode positioned in an area defined by the hole on the first surface of the board, a feed pad positioned on the first surface of the board and contacting the light emitting diode, an insulating dome positioned in the area defined by the hole on the first surface of the board and covering the light emitting diode, and at least one antistatic pad positioned in the area defined by the hole on the first surface of the board, without contacting the light emitting diode.

    MANUFACTURING METHOD OF HEAT DISSIPATION DEVICE-INTEGRATED HEAT DISSIPATION SUBSTRATE FOR SEMICONDUCTOR
    10.
    发明公开
    MANUFACTURING METHOD OF HEAT DISSIPATION DEVICE-INTEGRATED HEAT DISSIPATION SUBSTRATE FOR SEMICONDUCTOR 审中-公开

    公开(公告)号：EP4503870A1

    公开(公告)日：2025-02-05

    申请号：EP24190895.3

    申请日：2024-07-25

    Applicant: IMH Inc.

    Inventor： LEE, Jong Eun

    IPC: H05K3/00 ,  H01L23/373 ,  H05K1/02 ,  H01L23/473 ,  H01L21/48 ,  H01L23/367 ,  H05K1/00 ,  H01L23/427

    Abstract: A manufacturing method of a heat dissipation device-integrated heat dissipation substrate for a semiconductor includes a base processing step of preparing a first base plate and a second base plate in the form of metal plates that overlap each other and constitute a part of a metal base, and providing a first base and a second base in which a three-dimensional structure forming the heat media circulation space is formed on an inner surface of at least one of the first base plate and the second base plate, a base coupling step of coupling opposing inner surfaces of the first base and the second base against each other to form heat dissipation device-integrated base, an electrode metal plate preparation step of processing an electrode metal plate to form a groove pattern, and preparing an electrode metal plate configured to cover an area corresponding to at least one circuit unit, and an electrode metal plate bonding step of bonding, via insulating resin, the electrode metal plate to an upper surface of the heat dissipation device-integrated base.

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