发明公开
- 专利标题: Thermal expansion compensation assemblies
- 专利标题(中): 热膨胀补偿组件
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申请号: EP07253925.7申请日: 2007-10-03
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公开(公告)号: EP1909355A2公开(公告)日: 2008-04-09
- 发明人: Engel, Klaus Gunter , Vladimirescu, Mihai
- 申请人: Com Dev International Limited
- 申请人地址: 155 Sheldon Drive Cambridge ON N1R 7H6 CA
- 专利权人: Com Dev International Limited
- 当前专利权人: Com Dev International Limited
- 当前专利权人地址: 155 Sheldon Drive Cambridge ON N1R 7H6 CA
- 代理机构: Lloyd, Patrick Alexander Desmond
- 优先权: US543062 20061005
- 主分类号: H01P1/30
- IPC分类号: H01P1/30
摘要:
Filter and manifold compensation assemblies for thermal compensation of a filter cavity and a manifold which include at least one a lever element pivotally coupled to the filter or manifold at a first pivot point, an anchoring element pivotally coupled to the lever element at the second pivot point and secured to the housing of the filter or manifold, and a thermal expansion element having a lower coefficient of thermal expansion than the filter cavity or manifold and pivotally coupled to the lever element. The relative thermal expansion of the thermal expansion element in comparison with the thermal expansion of the filter or manifold causes the lever element to articulate and to displace the housing for thermal compensation. The degree of each displacement is proportional to the ratio between the distance between the second and first pivot points and the distance between the second and the third pivot points.
公开/授权文献
- EP1909355B1 Thermal expansion compensation assemblies 公开/授权日:2010-01-20
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