发明公开
EP1911543A1 SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH
有权
无铅很多关于用于控制焊浴浓度与CU-NI浓度的另外供给和方法
- 专利标题： SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH
- 专利标题（中）： 无铅很多关于用于控制焊浴浓度与CU-NI浓度的另外供给和方法
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申请号： EP06781247.9申请日： 2006-07-19
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公开(公告)号： EP1911543A1公开(公告)日： 2008-04-16
- 发明人: NISHIMURA, Tetsuro
- 申请人： Nihon Superior Sha Co., Ltd
- 申请人地址： 16-15, Esakacho 1-chome Suita-shi, Osaka 564-0063 JP
- 专利权人： Nihon Superior Sha Co., Ltd
- 当前专利权人： Nihon Superior Sha Co., Ltd
- 当前专利权人地址： 16-15, Esakacho 1-chome Suita-shi, Osaka 564-0063 JP
- 代理机构： Hering, Hartmut
- 优先权： JP2005208134 20050719
- 国际公布： WO2007010927 20070125
- 主分类号： B23K35/26
- IPC分类号： B23K35/26 ; B23K1/08 ; C22C13/00 ; H05K3/24 ; H05K3/34 ; B23K101/38
摘要：
Lead-free solder is replenished to a solder bath to receive a work having copper, the work to be processed subsequent to a soldering process using an air knife or a die. The replenished lead-free solder includes Sn as a major composition and at least 0.01 to 0.5 mass percent Ni. By replenishing the lead-free solder having the above composition, the density of the solder bath, being sharply changed for using one of a HASL device and a die, is quickly restored back to within an appropriate range.
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