公开(公告)号：EP4512217A1

公开(公告)日：2025-02-26

申请号：EP23722626.1

申请日：2023-04-12

Applicant: Safran Electronics & Defense

Inventor： CHETANNEAU, Patrice ,  LEFEVRE, Bruno ,  GUILLOT, François

IPC: H05K3/24 ,  H05K1/02 ,  H05K1/18 ,  H05K3/42 ,  H05K3/46

公开(公告)号：EP4297541A1

公开(公告)日：2023-12-27

申请号：EP23180578.9

申请日：2023-06-21

Applicant: TE Connectivity Germany GmbH ,  TE Connectivity Solutions GmbH

Inventor： Soneja, Shallu ,  Wu, Yiliang ,  Gulsoy, Gokce ,  Schmidt, Helge ,  Sachs, Soenke

IPC: H05K1/09 ,  H05K3/12 ,  H05K3/34 ,  H05K3/24 ,  H05K1/11

Abstract: The invention relates to a method for producing a surface finish (20) on an electrically conductive substrate (2), the method comprising the steps of transferring an ink (6) comprising electrically conductive particles (8) onto an area (20) of predetermined form and/or size on a surface (4) of the electrically conductive substrate (2) via gravure and/or flexo printing and heating the ink (6) to a temperature that is higher than a melting point of the conductive particles (8) creating a melt, which solidifies into the surface finish (20). Furthermore, the invention relates to an electric conductor (1) comprising an electrically conductive substrate (2) having a surface (4) with an area (10) of predetermined size and/or form on which a surface finish (20) is applied with the aforementioned method.

公开(公告)号：EP4297540A1

公开(公告)日：2023-12-27

申请号：EP22181010.4

申请日：2022-06-24

Applicant: TE Connectivity Germany GmbH ,  TE Connectivity Services GmbH

Inventor： SONEJA, Shallu ,  WU, Yiliang ,  GULSOY, Gokce ,  SACHS, Soenke ,  SCHMIDT, Helge

IPC: H05K1/09 ,  H05K3/12 ,  H05K3/34 ,  H05K3/24

Abstract: The invention relates to a method for producing a surface finish (20) on an electrically conductive substrate (2), the method comprising the steps of transferring an ink (6) comprising electrically conductive particles (8) onto an area (20) of predetermined form and/or size on a surface (4) of the electrically conductive substrate (2) via gravure and/or flexo printing and heating the ink (6) to a temperature that is higher than a melting point of the conductive particles (8) creating a melt, which solidifies into the surface finish (20). Furthermore, the invention relates to an electric conductor (1) comprising an electrically conductive substrate (2) having a surface (4) with an area (10) of predetermined size and/or form on which a surface finish (20) is applied with the aforementioned method.

公开(公告)号：EP3618129B1

公开(公告)日：2023-03-29

申请号：EP18791223.3

申请日：2018-04-20

Inventor： ABE,Yuuichi

IPC: H01L33/60 ,  H01L33/62 ,  H05K1/03 ,  H05K1/18 ,  H05K3/16 ,  H05K3/24 ,  H05K3/26 ,  H05K3/28

公开(公告)号：EP4068918A3

公开(公告)日：2023-01-18

申请号：EP22166178.8

申请日：2022-03-31

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Mok, Jeesoo ,  Baftiri, Artan

IPC: H05K3/46 ,  H05K1/18 ,  H01L23/498 ,  H05K3/24

Abstract: A method of manufacturing a component carrier (100) comprises: (i) embedding a poorly adhesive structure (110) in a stack (101), wherein the stack (101) comprises at least one electrically conductive layer structure (102) and/or at least one electrically insulating layer structure (103); (ii) forming a cavity (420) in the stack (101) by removing a stack piece, wherein the stack piece is in part delimited by the poorly adhesive structure (110); and (iii) selectively exposing a bottom (421) of the cavity (420) by partially removing the poorly adhesive structure (110). A corresponding component carrier (100) comprises analogous features.

公开(公告)号：EP3758456B1

公开(公告)日：2022-11-09

申请号：EP18906945.3

申请日：2018-02-22

Inventor： USHIKU Masayuki ,  OHYA Hidenobu ,  HOSHINO Hideki ,  YAMAUCHI Masayoshi ,  OMATA Takenori ,  NIIZUMA Naoto ,  AOYAMA Ryo ,  URAYAMA Kazuho

IPC: H05K3/24 ,  C25D5/02 ,  C25D5/56 ,  H05K1/09 ,  H05K3/12 ,  H05K1/02 ,  C25D3/12 ,  C25D3/38 ,  C25D3/56

公开(公告)号：EP4040924A1

公开(公告)日：2022-08-10

申请号：EP22157740.6

申请日：2016-08-11

Applicant: LG Innotek Co., Ltd.

Inventor： HWANG, Jung Ho ,  LEE, Han Su ,  CHOI, Dae Young ,  KWON, Soon Gyu ,  JEONG, Dong Hun ,  JEONG, In Ho ,  SON, Kil Dong ,  KIM, Sang Hwa ,  LEE, Sang Young ,  JEON, Jae Hoon ,  LEE, Jin Hak ,  BAE, Yun Mi

IPC: H05K3/10 ,  H05K3/24

Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first portion formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second portion formed on the first portion and configured to cover an upper surface of the first portion including the corner portion.

公开(公告)号：EP3063697B1

公开(公告)日：2022-04-06

申请号：EP14789264.0

申请日：2014-10-24

Inventor： PAVAGEAU, Stéphane ,  LAMBERT, Xavier

IPC: G06K7/00 ,  H05K1/02 ,  G06F21/86 ,  H05K3/14 ,  H05K3/24 ,  B23K101/42 ,  H05K3/12

公开(公告)号：EP3203514B1

公开(公告)日：2021-04-21

申请号：EP15845768.9

申请日：2015-09-28

Inventor： NISHIMOTO Shuji ,  NAGATOMO Yoshiyuki

IPC: H05K3/24 ,  H01L23/373 ,  H01L23/36 ,  H01L23/40 ,  H01L23/473 ,  H01L23/00 ,  H05K1/02 ,  H05K3/32 ,  H01L23/15 ,  H01L21/48 ,  H01L23/498

公开(公告)号：EP2161973B1

公开(公告)日：2019-05-22

申请号：EP07721251.2

申请日：2007-05-24

Applicant: Princo Corp.

Inventor： YANG, Chih-Kuang

IPC: H05K3/04 ,  H05K3/24 ,  H05K3/28 ,  H05K1/02 ,  H05K3/00 ,  H05K3/10 ,  H05K3/38