发明公开
EP1929071A1 COMPOSITION AND METHOD FOR ENHANCING POT LIFE OF HYDROGEN PEROXIDE-CONTAINING CMP SLURRIES
审中-公开
组合物和方法用于延长含有氢的CMP泥浆的适用期
- 专利标题： COMPOSITION AND METHOD FOR ENHANCING POT LIFE OF HYDROGEN PEROXIDE-CONTAINING CMP SLURRIES
- 专利标题（中）： 组合物和方法用于延长含有氢的CMP泥浆的适用期
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申请号： EP06803687.0申请日： 2006-09-15
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公开(公告)号： EP1929071A1公开(公告)日： 2008-06-11
- 发明人: WANG, Yuchun , LU, Bin , PARKER, John , MARTIN, Roger
- 申请人： CABOT MICROELECTRONICS CORPORATION
- 申请人地址： Legal Department 870 North Commons Drive Aurora, IL 60504 US
- 专利权人： CABOT MICROELECTRONICS CORPORATION
- 当前专利权人： CABOT MICROELECTRONICS CORPORATION
- 当前专利权人地址： Legal Department 870 North Commons Drive Aurora, IL 60504 US
- 代理机构： Trueman, Lucy Petra
- 优先权： US238236 20050929
- 国际公布： WO2007040956 20070412
- 主分类号： C23F3/06
- IPC分类号： C23F3/06 ; C09G1/02 ; H01L21/321
摘要：
A composition suitable for copper chemical-mechanical polishing (CMP) comprises an abrasive powder, such as a silica and/or alumina abrasive, in a liquid carrier. The composition has a transition metal content of less than about 5 parts per million (ppm), preferably less than about 2 ppm. Preferably the composition contains less than about 2 ppm of yttrium, zirconium, and/or iron. The CMP compositions, when combined with hydrogen peroxide, provide CMP slurries for copper CMP that have improved pot life by ameliorating hydrogen peroxide degradation in slurries.
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