专利检索 ap:("CABOT MICROELECTRONICS CORPORATION") AND inv:"MARTIN, Roger" 第 1 页

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发明公开
COMPOSITION AND METHOD FOR ENHANCING POT LIFE OF HYDROGEN PEROXIDE-CONTAINING CMP SLURRIES 审中-公开
标题翻译：组合物和方法用于延长含有氢的CMP泥浆的适用期

公开(公告)号：EP1929071A1

公开(公告)日：2008-06-11

申请号：EP06803687.0

申请日：2006-09-15

申请人： CABOT MICROELECTRONICS CORPORATION

发明人： WANG, Yuchun , LU, Bin , PARKER, John , MARTIN, Roger

IPC分类号： C23F3/06 , C09G1/02 , H01L21/321

CPC分类号： C09G1/02 , C23F3/06 , H01L21/3212

摘要： A composition suitable for copper chemical-mechanical polishing (CMP) comprises an abrasive powder, such as a silica and/or alumina abrasive, in a liquid carrier. The composition has a transition metal content of less than about 5 parts per million (ppm), preferably less than about 2 ppm. Preferably the composition contains less than about 2 ppm of yttrium, zirconium, and/or iron. The CMP compositions, when combined with hydrogen peroxide, provide CMP slurries for copper CMP that have improved pot life by ameliorating hydrogen peroxide degradation in slurries.