发明授权
- 专利标题： ELEKTROLYTISCHES VERFAHREN ZUM FÜLLEN VON LÖCHERN UND VERTIEFUNGEN MIT METALLEN
- 专利标题（英）： Electrolytic method for filling holes and cavities with metals
- 专利标题（中）： 电解工艺填充孔和良好与金属
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申请号： EP07723814.5申请日： 2007-03-30
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公开(公告)号： EP2000013B1公开(公告)日： 2010-10-13
- 发明人: REENTS, Bert , ROELFS, Bernd , MAGAYA, Tafadzwa , YOUKHANIS, Markus , WENZEL, René , KIM, Soungsoo
- 申请人： ATOTECH Deutschland GmbH
- 申请人地址： Erasmusstraße 20 10553 Berlin DE
- 专利权人： ATOTECH Deutschland GmbH
- 当前专利权人： ATOTECH Deutschland GmbH
- 当前专利权人地址： Erasmusstraße 20 10553 Berlin DE
- 代理机构： Beckmann, Claus
- 优先权： EP06090045 20060330
- 国际公布： WO2007112971 20071011
- 主分类号： H05K3/42
- IPC分类号： H05K3/42 ; H05K3/18 ; C25D3/00 ; C25D5/00
摘要：
Disclosed is an electroplating method for filling cavities, through holes, pocket holes, or micropocket holes of a workpiece with metals. According to said method, the workpiece containing cavities, through holes, pocket holes, or micropocket holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the workpiece and at least one anode such that a current flow is fed to the workpiece. The inventive method is characterized in that the electrolyte encompasses a redox system.
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