发明公开
EP2013632A2 PROBE STRUCTURES WITH ELECTRONIC COMPONENTS 审中-公开
电子元件探针结构

  • 专利标题: PROBE STRUCTURES WITH ELECTRONIC COMPONENTS
  • 专利标题(中): 电子元件探针结构
  • 申请号: EP07755797.3
    申请日: 2007-04-19
  • 公开(公告)号: EP2013632A2
    公开(公告)日: 2009-01-14
  • 发明人: KHANDROS, Igor K.GRITTERS, John K.
  • 申请人: FormFactor, Inc.
  • 申请人地址: 7005 Southfront Road Livermore, CA 94551 US
  • 专利权人: FormFactor, Inc.
  • 当前专利权人: FormFactor, Inc.
  • 当前专利权人地址: 7005 Southfront Road Livermore, CA 94551 US
  • 代理机构: Harris, Ian Richard
  • 优先权: US379760 20060421
  • 国际公布: WO2007124050 20071101
  • 主分类号: G01R31/02
  • IPC分类号: G01R31/02
PROBE STRUCTURES WITH ELECTRONIC COMPONENTS
摘要:
A probe apparatus can include a substrate, a contact structure attached to the substrate, and an electronic component electrically connected to the contact structure. The electronic component can be attached to the contact structure.
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