发明公开
- 专利标题： High speed method for plating palladium and palladium alloys
- 专利标题（中）： 电镀钯及钯合金高速方法
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申请号： EP08160839.0申请日： 2008-07-21
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公开(公告)号： EP2017373A3公开(公告)日： 2013-09-11
- 发明人: Zhang-Beglinger, Wan , Clauss, Margit , Schwager, Felix J , Guebey, Jonas
- 申请人： Rohm and Haas Electronic Materials LLC
- 申请人地址： 455 Forest Street Marlborough, MA 01752 US
- 专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人地址： 455 Forest Street Marlborough, MA 01752 US
- 代理机构： Buckley, Guy Julian
- 优先权： US961393P 20070720
- 主分类号： C25D3/50
- IPC分类号： C25D3/50
摘要：
A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.
公开/授权文献
- EP2017373B1 HIGH SPEED METHOD FOR PLATING PALLADIUM ALLOYS 公开/授权日：2018-09-26
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