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公开(公告)号：EP2565297A3
公开(公告)日：2013-04-24
申请号：EP12180894.3
申请日：2012-08-17
摘要： White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals.
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公开(公告)号：EP2017373A3
公开(公告)日：2013-09-11
申请号：EP08160839.0
申请日：2008-07-21
IPC分类号： C25D3/50
摘要： A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.
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公开(公告)号：EP2565297A2
公开(公告)日：2013-03-06
申请号：EP12180894.3
申请日：2012-08-17
IPC分类号： C25D3/60
摘要： White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals.
摘要翻译： 白青铜从不含氰化物的锡/铜浴电镀到涂覆铜底层的空隙抑制层上。 空洞抑制金属层包括一种或多种空洞抑制金属。
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公开(公告)号：EP2634292A1
公开(公告)日：2013-09-04
申请号：EP13156522.8
申请日：2013-02-25
CPC分类号： C25D3/54 , C23C18/1653 , C25D5/10 , C25D7/00 , C25D7/005 , Y10T428/12896
摘要： A thin indium metal layer is electroplated onto silver to prevent silver tarnishing. The indium and silver composite has high electrical conductivity.
摘要翻译： 将薄的铟金属层电镀到银上以防止银变色。 铟和银复合材料具有高导电性。
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公开(公告)号：EP2309036A1
公开(公告)日：2011-04-13
申请号：EP10178645.7
申请日：2010-09-23
发明人： Zhang, Wan , Guebey, Jonas , Egli, Andre
摘要： Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold.
摘要翻译： 公开了用于抑制金属从镀有硬金的基板的位移的抗置换硬金组合物。 反位移硬金组合物可用于用硬金定位平板底物。
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6.发明公开High speed method for plating palladium and palladium alloys 审中-公开Hochgeschwindigkeitsverfahren zur Plattierung von Palladium und Palladiumlegierungen
公开(公告)号：EP2017373A2
公开(公告)日：2009-01-21
申请号：EP08160839.0
申请日：2008-07-21
IPC分类号： C25D3/50
摘要： A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.
摘要翻译： 公开了一种沉积钯和钯合金的高速方法。 高速方法使用在浴中还原游离氨的水性氨基浴。 高速方法可用于将钯和钯合金涂层沉积在诸如电气设备和首饰的各种基材上。
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公开(公告)号：EP2017373B1
公开(公告)日：2018-09-26
申请号：EP08160839.0
申请日：2008-07-21
摘要： A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.
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公开(公告)号：EP2738290A1
公开(公告)日：2014-06-04
申请号：EP14156872.5
申请日：2012-08-17
摘要： White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals.
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公开(公告)号：EP2309036B1
公开(公告)日：2013-08-28
申请号：EP10178645.7
申请日：2010-09-23
发明人： Zhang, Wan , Guebey, Jonas , Egli, Andre
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公开(公告)号：EP2634292B1
公开(公告)日：2019-10-02
申请号：EP13156522.8
申请日：2013-02-25
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