发明授权
- 专利标题: TEMPERATURSONDE
- 专利标题(英): Temperature probe
- 专利标题(中): 温度探头
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申请号: EP07729895.8申请日: 2007-06-05
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公开(公告)号: EP2024719B1公开(公告)日: 2010-12-22
- 发明人: VAN BEKKUM, Frank
- 申请人: Endress+Hauser GmbH+Co. KG
- 申请人地址: Hauptstrasse 1 79689 Maulburg DE
- 专利权人: Endress+Hauser GmbH+Co. KG
- 当前专利权人: Endress+Hauser GmbH+Co. KG
- 当前专利权人地址: Hauptstrasse 1 79689 Maulburg DE
- 代理机构: Andres, Angelika Maria
- 优先权: DE102006026515 20060606
- 国际公布: WO2007141265 20071213
- 主分类号: G01K1/02
- IPC分类号: G01K1/02
摘要:
The invention describes a cost-effective temperature probe which can be used in a flexible manner and has a sleeve (19, 25), a plurality of temperature sensors (T1, ..., Tx) which are arranged above one another in the sleeve (19, 25), are respectively connected, in a parallel manner with respect to one another, to earth (GND) and to a communication line (K) that is routed in the sleeve (19, 25) and are supplied with energy via said line, and a superordinate unit (23) which is connected to the communication line (K), in which each temperature sensor (T1, ..., TN) is used to measure a local temperature in the area surrounding the respective temperature sensor (T1, ..., TN) and to provide the superordinate unit (23) with said temperature in the form of a digital temperature signal using the communication line (K).
公开/授权文献
- EP2024719A1 TEMPERATURSONDE 公开/授权日:2009-02-18
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