发明公开
- 专利标题： DICING/DIE BONDING FILM
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申请号： EP06797847申请日： 2006-09-12
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公开(公告)号： EP2063460A4公开(公告)日： 2011-08-03
- 发明人: MATSUMURA TAKESHI , MISUMI SADAHITO
- 申请人： NITTO DENKO CORP
- 专利权人： NITTO DENKO CORP
- 当前专利权人： NITTO DENKO CORP
- 优先权： JP2006318055 2006-09-12
- 主分类号： H01L21/683
- IPC分类号： H01L21/683
摘要：
The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer and a die bonding adhesive layer being sequentially laminated on a supporting substrate, wherein the pressure-sensitive adhesive layer has a thickness of 10 µm to 80 µm, and has a storage elastic modulus at 23 °C of 1 x 10 4 to 1 x 10 10 Pa.
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