公开(公告)号：EP1125956A4

公开(公告)日：2001-12-19

申请号：EP99940624

申请日：1999-09-02

申请人： NITTO DENKO CORP

发明人： MISUMI SADAHITO ,  SAKAMOTO MICHIE ,  HIKITA TAKAMI ,  SATSUMA MICHIO ,  MOCHIZUKI AMANE

IPC分类号： C08J5/18 ,  C08G18/02 ,  C08L75/00 ,  C09D5/25 ,  H01B3/30 ,  H01B7/29

CPC分类号： H01B3/306 ,  C08G18/025 ,  Y10S525/907 ,  Y10T428/31721

摘要： An aromatic polycarbodiimide having structural units represented by formula (I) (wherein R represents a C3+ organic group and n is an integer of 2 to 300); a solution of the aromatic polycarbodiimide; a polycarbodiimide sheet; and an insulated electric wire. The polycarbodiimide has high solubility in organic solvents, has satisfactory processability, and is excellent in heat resistance and moisture resistance. The insulated wire has excellent durability under high-tension high humidity conditions and is highly reliable.

公开(公告)号：EP1004630A4

公开(公告)日：2002-03-13

申请号：EP99923894

申请日：1999-06-03

申请人： NITTO DENKO CORP

发明人： TANIGUCHI TAKASHI ,  YAMANE MINORU ,  NISHIOKA TSUTOMU ,  HARADA TADAAKI ,  HOSOKAWA TOSHITSUGU ,  IKEMURA KAZUHIRO ,  MISUMI SADAHITO ,  OHIZUMI SHINICHI

IPC分类号： C08L63/00 ,  H01L23/29 ,  C08G59/62 ,  C08K3/00 ,  H01L21/56

CPC分类号： H01L23/293 ,  C08L63/00 ,  H01L2224/45144 ,  H01L2224/48091 ,  Y10S524/904 ,  Y10S525/934 ,  C08L61/04 ,  C08L2666/22 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor sealing epoxy resin containing an epoxy resin, a phenol resin, a curing accelerator and an inorganic filler, which has the following properties, (X) to (Z): (X) 50 to 500 poise in terms of a viscosity at 175 °C, as measured using a flow tester, (Y) 1 x 105 poise or less in terms of the minimum melt viscosity, in a temperature distribution of viscosity, as measured at a shear rate of 5 (1/s) by means of a dynamic viscoelasticity measuring apparatus, and (Z) 2.0 or more in terms of a viscosity ratio (Z1/Z2) of a viscosity at 90 °C (Z1) to a viscosity at 110 °C (Z2), as measured at a shear rate of 5 (1/s) by means of a dynamic viscoelasticity-measuring apparatus. The semiconductor sealing epoxy resin is free from the occurrence of shift of the position of a semiconductor element by flow of a resin during sealing and of tilt of a chip by metal wire run or the like, and can be used for providing a semiconductor device exhibiting high reliability.

公开(公告)号：EP2063460A4

公开(公告)日：2011-08-03

申请号：EP06797847

申请日：2006-09-12

申请人： NITTO DENKO CORP

发明人： MATSUMURA TAKESHI ,  MISUMI SADAHITO

IPC分类号： H01L21/683

CPC分类号： H01L24/83 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3142 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/85 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/48 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/3025 ,  Y10T428/26 ,  H01L2924/0675 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/05432 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer and a die bonding adhesive layer being sequentially laminated on a supporting substrate, wherein the pressure-sensitive adhesive layer has a thickness of 10 µm to 80 µm, and has a storage elastic modulus at 23 °C of 1 x 10 4 to 1 x 10 10 Pa.

公开(公告)号：EP1315220A4

公开(公告)日：2005-11-16

申请号：EP01917822

申请日：2001-04-04

申请人： NITTO DENKO CORP

发明人： URAIRI MASAKATSU ,  KII KEISUKE ,  KISHII YUTAKA ,  YAMAMURA YUTAKA ,  ABE MASAO ,  MISUMI SADAHITO ,  ASAI FUMITERU

IPC分类号： H01M2/16 ,  H01M4/02 ,  H01M4/24 ,  H01M4/60 ,  H01M10/30 ,  H01M10/34 ,  H01M10/40

CPC分类号： H01M2/16 ,  H01M4/02 ,  H01M4/24 ,  H01M4/60 ,  H01M10/30 ,  H01M10/34 ,  Y02E60/124 ,  Y02P70/54

摘要： A battery highly inhibited from suffering self-discharge. The battery is characterized by containing a built-in polymer having in the molecule a carbodiimide unit represented by the following formula (I) wherein R means an organic group and n means an integer of 1 to 10,000.

摘要翻译： 电池受到自我放电的严重抑制。 该电池的特征在于含有分子内具有下式（I）表示的碳二亚胺单元的内置聚合物，其中R表示有机基团，n表示1至10,000的整数。

公开(公告)号：EP1205986A4

公开(公告)日：2003-01-08

申请号：EP01917823

申请日：2001-04-04

申请人： NITTO DENKO CORP

发明人： URAIRI MASAKATSU ,  KII KEISUKE ,  KISHII YUTAKA ,  YAMAMURA YUTAKA ,  ABE MASAO ,  MISUMI SADAHITO

IPC分类号： H01M2/14 ,  H01M2/16 ,  H01M10/30 ,  H01M10/34

CPC分类号： H01M2/1653 ,  H01M2/145 ,  H01M2/1666 ,  H01M10/30 ,  H01M10/345

摘要： A separator capable of inhibiting a battery from suffering self-discharge. The separator is a battery separator which comprises a porous sheet substrate and applied thereto a polymer having in the molecule a carbodiimide unit represented by the following formula (I): -[-R-N=C=N-]n- wherein R means an organic group and n means an integer of 1 to 10,000.