The present invention relates to a method for aligning and bonding elements for the fabrication of a semiconductor device, comprising providing a first element with a protrusion, the first element having a front main surface and a back main surface, providing a second element having a front main surface and a back main surface, the second element including a front portion located at the front main surface and a back portion located at the back main surface, providing at least one metal pad, forming at least one blind hole in the second element, the hole extending from the back main surface to the metal pad thereby exposing the metal pad, aligning the protrusion of the first element with the corresponding hole of the second element; inserting the protrusion of the first element into the blind hole of the second element, bonding the protrusion to the metal pad, so that the protrusion makes electrical contact with the metal pad and the first element is bonded to the second element.