Invention Publication
- Patent Title: HIGH FREQUENCY CIRCUIT, HIGH FREQUENCY COMPONENT AND COMMUNICATION DEVICE
- Patent Title (中): 高频电路,高频成分,通信设备
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Application No.: EP07850822Application Date: 2007-12-18
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Publication No.: EP2128996A4Publication Date: 2014-03-26
- Inventor: KEMMOCHI SHIGERU , FUKAMACHI KEISUKE , HAGIWARA KAZUHIRO
- Applicant: HITACHI METALS LTD
- Assignee: HITACHI METALS LTD
- Current Assignee: HITACHI METALS LTD
- Priority: JP2006341217 2006-12-19; JP2006353755 2006-12-28; JP2007186749 2007-07-18
- Main IPC: H04B1/50
- IPC: H04B1/50 ; H03H7/01 ; H03H7/09 ; H03H7/18 ; H03H7/46 ; H04B1/00 ; H04B1/44
Abstract:
An inventive high frequency circuit includes a switch circuit (SPDT1), connected to an antenna terminal (Ant1), using a field-effect transistor for switching between a connection with first to third transmitting terminals (Tx1-1, Tx2-1, Tx3-1) and a connection with first to third receiving terminals (Rx1-1, Rx2-1, Rx3-1); a transmitting-side triplexer (Trip1) for branching a transmitting path connected to the switch circuit into transmitting paths of first to third frequency bands; and a receiving-side triplexer (Trip2) for branching a receiving path connected to the switch circuit into receiving paths of the first to third frequency bands. The switch circuit can be formed as an IC to downsize the circuit. For example, in constructing the high frequency circuit with a laminated module using a ceramic laminated substrate or the like, particularly when the number of triplexers occupying a large space is large, the switch circuit is formed as an IC and mounted on the laminated body, whereby the whole structure can be downsized.
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