发明公开
- 专利标题： CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS
- 专利标题（中）： Micro Devices公司的基于连接的烧蚀MOVIES
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申请号： EP08742558.3申请日： 2008-04-04
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公开(公告)号： EP2147463A2公开(公告)日： 2010-01-27
- 发明人: ALI, Mohammad Zaki , STOLT, Peter Axel , HAWKINS, Gilbert Allen , STEPHANY, Thomas Michael
- 申请人： Eastman Kodak Company
- 申请人地址： 343 State Street Rochester NY 14650-2201 US
- 专利权人： Eastman Kodak Company
- 当前专利权人： Eastman Kodak Company
- 当前专利权人地址： 343 State Street Rochester NY 14650-2201 US
- 代理机构： Weber, Etienne Nicolas
- 优先权： US737187 20070419
- 国际公布： WO2008130493 20081030
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/48 ; H05K3/10 ; G01N27/28 ; H01L21/48
摘要：
A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.
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