发明公开
EP2216290A2 Mitigation of high stress areas in vertically offset structures
审中-公开
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- 专利标题: Mitigation of high stress areas in vertically offset structures
- 专利标题(中): on n n n n n n n n n n n n n n n n
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申请号: EP09176967.9申请日: 2009-11-24
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公开(公告)号: EP2216290A2公开(公告)日: 2010-08-11
- 发明人: Foster, Michael , Jafri, Ijaz H.
- 申请人: Honeywell International Inc.
- 申请人地址: 101 Columbia Road Morristown, NJ 07962 US
- 专利权人: Honeywell International Inc.
- 当前专利权人: Honeywell International Inc.
- 当前专利权人地址: 101 Columbia Road Morristown, NJ 07962 US
- 代理机构: Buckley, Guy Julian
- 优先权: US366799 20090206
- 主分类号: B81C1/00
- IPC分类号: B81C1/00
摘要:
Alternative methods of constructing a vertically offset structure are disclosed. An embodiment includes forming a flexible layer (12) having first and second end portions (13, 14), an intermediate portion (70) coupling the first and second portions, and upper and lower surfaces (48, 15). The distance between the upper and lower surfaces at the intermediate portion is less than the distance between the upper and lower surfaces at the first and second end portions. The first end portion is bonded to a base member (44). The second end portion of the flexible layer is deflected until the second end portion contacts the base member. The second end portion is bonded to the base member.
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