发明公开
EP2223393A4 ELECTRONIC ASSEMBLY AND METHOD OF MANUFACTURING SAME
审中-公开
ELEKTRONISCHE ANORDNUNG UND HERSTELLUNGSVERFAHRENDAFÜR
- 专利标题： ELECTRONIC ASSEMBLY AND METHOD OF MANUFACTURING SAME
- 专利标题（中）： ELEKTRONISCHE ANORDNUNG UND HERSTELLUNGSVERFAHRENDAFÜR
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申请号： EP08867449申请日： 2008-12-18
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公开(公告)号： EP2223393A4公开(公告)日： 2014-04-09
- 发明人: BLOSSFELD MIKE , SANCHEZ LUIS FERNANDO
- 申请人： TRW AUTOMOTIVE US LLC
- 专利权人： TRW AUTOMOTIVE US LLC
- 当前专利权人： TRW AUTOMOTIVE US LLC
- 优先权： US839307 2007-12-20
- 主分类号： H01R13/66
- IPC分类号： H01R13/66 ; H01R12/72 ; H01R13/447 ; H01R13/506
摘要：
An electronic assembly comprises a housing, a cover for the housing, a printed circuit board receivable in the housing, and a compliant pin header assembly. The compliant pin header assembly is mountable in the housing by interengaging features on the header assembly and the housing. The compliant pin header assembly has compliant pins for engaging corresponding features on the printed circuit board to connect the compliant pin header assembly electrically to the printed circuit board. The cover, when the electronic assembly is assembled, engages the housing and also engages the printed circuit board at a location spaced from an outer periphery of the printed circuit board.
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