发明公开
- 专利标题： Double side cooled power module with power overlay
- 专利标题（中）： 与功率覆盖双面冷却的功率模块
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申请号： EP10155503.5申请日： 2010-03-04
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公开(公告)号： EP2228820A3公开(公告)日： 2016-01-20
- 发明人: Beaupre, Richard Alfred , Gowda, Arun Virupaksha , Stevanovic, Ljubisa Dragoljub , Solovitz, Stephen Adam
- 申请人： General Electric Company
- 申请人地址： 1 River Road Schenectady, NY 12345 US
- 专利权人： General Electric Company
- 当前专利权人： General Electric Company
- 当前专利权人地址： 1 River Road Schenectady, NY 12345 US
- 代理机构： Bedford, Grant Richard
- 优先权： US404272 20090313
- 主分类号： H01L23/373
- IPC分类号： H01L23/373
摘要：
A power module (20) includes one or more semiconductor power devices (22) having a power overlay (POL) (24) bonded thereto. A first heat sink assembly (30), is bonded to the semiconductor power devices (22) on a side opposite the POL (24). A second heat sink assembly (28) is bonded to the POL (24) opposite the side of the POL (24) bonded to the semiconductor power devices (24). The semiconductor power devices (22), POL (24), first channel heat sink assembly (30), and second channel heat sink assembly (28) together form a double side cooled power overlay module. The second channel heat sink assembly (28) is bonded to the POL (24) solely via a compliant thermal interface material (26) without the need for planarizing, brazing or metallurgical bonding.
公开/授权文献
- EP2228820A2 Double side cooled power module with power overlay 公开/授权日：2010-09-15
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