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39 条记录 (耗时 0.015 秒)

    Diffusion barrier for surface mount modules
    3.
    发明公开
    Diffusion barrier for surface mount modules 审中-公开
    Diffusionbarrierefüroberflächenmontierte模块

    公开(公告)号：EP2693470A2

    公开(公告)日：2014-02-05

    申请号：EP13177219.6

    申请日：2013-07-19

    申请人： General Electric Company

    发明人： Gowda, Arun Virupaksha ,  McConnelee, Paul Alan ,  Zhao, Ri-an ,  Chauhan, Shakti Singh

    IPC分类号： H01L23/31 ,  H01L23/532 ,  H01L23/538 ,  H01L23/00

    摘要： A surface-mount package structure (10) for reducing the ingress of moisture and gases thereto is disclosed. The surface-mount structure (10) includes a sub-module (14) having a dielectric layer (30), semiconductor devices (12) attached to the dielectric layer (30), a first level interconnect structure (28) electrically coupled to the semiconductor devices (12), and a second level I/O connection (16) electrically coupled to the first level interconnect (38) and formed on the dielectric layer (30), with the second level I/O connection (16) configured to connect the sub-module (14) to an external circuit. The semiconductor devices (12) of the sub-module (14) are attached to a substrate structure (18), with a dielectric material (26) positioned between the dielectric layer (30) and the substrate structure (18) to fill in gaps in the surface-mount structure (10). A diffusion barrier layer (28) is applied over the sub-module (14), adjacent the first and second level I/O connections (38,16), and extends down to the substrate structure (18) to reduce the ingress of moisture and gases from a surrounding environment into the surface-mount structure (10).

    摘要翻译： 公开了一种用于减少水分和气体进入的表面贴装封装结构（10）。 表面安装结构（10）包括具有电介质层（30）的子模块（14），附着到电介质层（30）的半导体器件（12），与第一级互连结构 半导体器件（12）和电耦合到第一电平互连（38）并形成在电介质层（30）上的第二电平I / O连接（16），其中第二电平I / O连接（16）被配置为 将子模块（14）连接到外部电路。 子模块（14）的半导体器件（12）被附接到衬底结构（18）上，其中电介质材料（26）位于介电层（30）和衬底结构（18）之间以填充间隙 在表面安装结构（10）中。 扩散阻挡层（28）施加在子模块（14）上，邻近第一和第二级I / O连接（38,16），并向下延伸到衬底结构（18）以减少水分的进入 以及来自周围环境的气体进入表面安装结构（10）。

    Double side cooled power module with power overlay
    5.
    发明公开
    Double side cooled power module with power overlay 审中-公开
    多刺激。。。。。。。。。。。。

    公开(公告)号：EP2228820A2

    公开(公告)日：2010-09-15

    申请号：EP10155503.5

    申请日：2010-03-04

    申请人： General Electric Company

    发明人： Beaupre, Richard Alfred ,  Gowda, Arun Virupaksha ,  Stevanovic, Ljubisa Dragoljub ,  Solovitz, Stephen Adam

    IPC分类号： H01L23/373

    CPC分类号： H01L23/3735 ,  H01L23/051 ,  H01L23/42 ,  H01L23/473 ,  H01L24/24 ,  H01L25/072 ,  H01L2224/24137 ,  H01L2224/92144 ,  H01L2924/01029 ,  H01L2924/14

    摘要： A power module (20) includes one or more semiconductor power devices (22) having a power overlay (POL) (24) bonded thereto. A first heat sink assembly (30), is bonded to the semiconductor power devices (22) on a side opposite the POL (24). A second heat sink assembly (28) is bonded to the POL (24) opposite the side of the POL (24) bonded to the semiconductor power devices (24). The semiconductor power devices (22), POL (24), first channel heat sink assembly (30), and second channel heat sink assembly (28) together form a double side cooled power overlay module. The second channel heat sink assembly (28) is bonded to the POL (24) solely via a compliant thermal interface material (26) without the need for planarizing, brazing or metallurgical bonding.

    摘要翻译： 功率模块（20）包括一个或多个具有与其结合的功率覆盖（POL）（24）的半导体功率器件（22）。 第一散热器组件（30）在与POL（24）相对的一侧上接合到半导体功率器件（22）。 第二散热器组件（28）结合到与结合到半导体功率器件（24）的POL（24）侧相对的POL（24）。 半导体功率器件（22），POL（24），第一通道散热器组件（30）和第二通道散热器组件（28）一起形成双面冷却功率覆盖模块。 第二通道散热器组件（28）仅通过柔性热界面材料（26）结合到POL（24），而不需要平坦化，钎焊或冶金结合。

    Sealed wafer packaging of microelectromechanical systems
    6.
    发明公开
    Sealed wafer packaging of microelectromechanical systems 审中-公开
    Abgedichtete Waferverpackung von mikroelektromechanischen Systemen

    公开(公告)号：EP2050712A2

    公开(公告)日：2009-04-22

    申请号：EP08166371.8

    申请日：2008-10-10

    申请人： General Electric Company

    发明人： Aimi, Marco Francesco ,  Kapusta, Christopher James ,  Gowda, Arun Virupaksha ,  Hays, David Cecil ,  Boomhoower, Oliver Charles ,  Claydon, Glenn Scott ,  Iannotti, Joseph Alfred ,  Keimel, Christopher Fred

    IPC分类号： B81C1/00

    CPC分类号： B81C1/00269 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/032 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/00

    摘要： Multiple microelectromechanical systems (MEMS) on a substrate (20) are capped with a cover (28) using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate (20) has a first side (20A) with multiple MEMS devices. A cover (28) is formed with through-holes (40) for vias (40), and with standoff posts (34) for layer registration and separation. An adhesive sheet (42) is patterned with cutouts (44) for the MEMS devices, vias (40), and standoff posts (34). The adhesive sheet (42) is tacked to the cover (28), then placed on the mems substrate (20) and heated to bond the layers. The via holes (40) may be metalized with leads for circuit board (58) connection. The mems units (22) may be diced from the substrate (20) after sealing, thus protecting them from contaminants.

    摘要翻译： 使用可用作粘合剂，分离层和气密密封的层，用盖（28）将基材（20）上的多个微机电系统（MEMS）封盖。 衬底（20）具有多个MEMS器件的第一侧（20A）。 盖（28）形成有用于通孔（40）的通孔（40）和用于层对准和分离的支柱（34）。 图案化粘合片（42），用于MEMS器件，通孔（40）和支柱（34）的切口（44）。 将粘合片（42）固定到盖（28）上，然后放置在MEM基板（20）上并加热以粘合层。 通孔（40）可以用电路板（58）连接的引线金属化。 密封单元（22）可以在密封之后从基板（20）切割，从而保护它们免受污染。

    Contact material, device including contact material, and method of making
    7.
    发明公开
    Contact material, device including contact material, and method of making 审中-公开
    接触材料，与其接触的材料和制造方法的装置

    公开(公告)号：EP1876614A3

    公开(公告)日：2008-09-24

    申请号：EP07111765.9

    申请日：2007-07-04

    申请人： GENERAL ELECTRIC COMPANY

    发明人： Srinivasan, Duraiswamy ,  Corderman, Reed Roeder ,  Keimel, Christopher Fred ,  Gunasekaran, Somasundaram ,  Reddy, Sudhakar E ,  Gowda, Arun Virupaksha ,  Subramanian, Kanakasabapathi

    IPC分类号： H01H1/021

    CPC分类号： H01H1/021

    摘要： A device for controlling the flow of electric current is provided. The device comprises a first conductor (12); a second conductor (14) switchably coupled to the first conductor (12) to alternate between an electrically connected state with the first conductor (12) and an electrically disconnected state with the first conductor (12). At least one conductor further comprises an electrical contact (40), the electrical contact (40) comprising a solid matrix (42) comprising a plurality of pores (44); and a filler material (46) disposed within at least a portion of the plurality of pores (44). The filler material (46) has a melting point of less than about 575K. A method (50) to make an electrical contact (40) is provided. The method (50) includes the steps of: providing a substrate; providing a plurality of pores (44) on the substrate; and disposing a filler material within at least a portion of the plurality of pores (44). The filler material (46) has a melting point of less than about 575K.