发明公开
EP2229466A1 PLASMA ACTIVATED CHEMICAL VAPOUR DEPOSITION METHOD AND APPARATUS THEREFOR
审中-公开
方法等离子体激活CVD及其装置的
- 专利标题: PLASMA ACTIVATED CHEMICAL VAPOUR DEPOSITION METHOD AND APPARATUS THEREFOR
- 专利标题(中): 方法等离子体激活CVD及其装置的
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申请号: EP08860425.1申请日: 2008-12-12
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公开(公告)号: EP2229466A1公开(公告)日: 2010-09-22
- 发明人: NICOLESCU, Mihai , HJALMARSSON, Äke , KOUZNETSOV, Klim
- 申请人: Plasmatrix Materials AB
- 申请人地址: Teknikringen 33 114 28 Stockholm SE
- 专利权人: Plasmatrix Materials AB
- 当前专利权人: Plasmatrix Materials AB
- 当前专利权人地址: Teknikringen 33 114 28 Stockholm SE
- 代理机构: Strandin, Heléne
- 优先权: SE0702770 20071212
- 国际公布: WO2009075629 20090618
- 主分类号: C23C16/515
- IPC分类号: C23C16/515 ; C23C16/44 ; C23C16/52 ; H01J37/32
摘要:
In plasma activated chemical vapour deposition a plasma decomposition unit (1) is used that is arranged in or connected to a vacuum vessel having a relatively low pressure or vacuum, to which an operating gas is provided. Periodically- repeated voltage pulses are applied between the anode (15a: 15b) and the cathode (7) of the plasma decomposition unit in such a manner that pulsed electric discharges are produced between the cathode and the surrounding anode of the plasma decomposition unit. The anode is arranged in a special way so that at least a portion thereof will obtain only an electrically conductive coating or substantially no coating when operating the unit. For that purpose, the anode includes a portion (15a) located in the direct vicinity of the free surface (5) of the cathode. The portion is a flange or edge portion which is located or extends over margins of the free surface of the cathode. In that way, the anode will include a portion (17) that is shielded for direct coating with particles from the plasma formed and that hence will obtain e.g. substantially no dielectric coating at all.
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