The invention relates to a circuit board arrangement and to an electric connection module having a carrier module and at least one electric contact, and to an attachment module, wherein the invention provides that the attachment module is used for the protection against the touch of the at least one electric contact, and is made of an elastic plastic, and wherein further the carrier module is provided for accommodating the at least one electric contact. For this purpose the carrier module is made of another temperature-resistant plastic in order to be suitable for a soldering process at high temperatures. During the soldering process, at least one electric contact can be soldered to a circuit board.