发明公开
EP2252463A1 FABRICATION OF A PRINTHEAD INTEGRATED CIRCUIT ATTACHMENT FILM BY PHOTOPATTERNING
审中-公开
制作一个头IC定影膜，通过光结构
- 专利标题： FABRICATION OF A PRINTHEAD INTEGRATED CIRCUIT ATTACHMENT FILM BY PHOTOPATTERNING
- 专利标题（中）： 制作一个头IC定影膜，通过光结构
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申请号： EP08714426.7申请日： 2008-03-17
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公开(公告)号： EP2252463A1公开(公告)日： 2010-11-24
- 发明人: LEE, Seung Jin , TAY, Martin Tiong We , SILVERBROOK, Kia
- 申请人： Silverbrook Research Pty. Ltd
- 申请人地址： 393 Darling Street Balmain, New South Wales 2041 AU
- 专利权人： Silverbrook Research Pty. Ltd
- 当前专利权人： Silverbrook Research Pty. Ltd
- 当前专利权人地址： 393 Darling Street Balmain, New South Wales 2041 AU
- 代理机构： Keane, Paul Fachtna
- 国际公布： WO2009114893 20090924
- 主分类号： B41J2/175
- IPC分类号： B41J2/175 ; C08J5/18
摘要：
A method of fabricating a film for attachment of one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing an adhesive polymeric film, the film being comprised of one or more photopatternable materials; (b) exposing predetermined regions of the film through a mask; and (c) developing the film to define a plurality of ink supply holes.
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