The method for providing the solder connection of the present invention is a method for providing a solder connection, which electrically connects a first electronic component having a solder bump to a second electronic component having a protruded electrode to provide electrical connection between the first solder bump and the protruded electrode, wherein a relation of: A + B > C is satisfied, where a height of the first solder bump from one surface of the first electronic component is presented as A [µm], a height of the protruded electrode before the compressive deformation from one surface of the second electronic component is presented as B [µm], and a thickness of the adhesive agent layer is presented as C [µm], and further comprising: disposing the adhesive agent layer in the first electronic component; and deforming the first solder bump and the protruded electrode and providing a contact of the above-described protruded electrode with the above-described first solder bump, so that the sum of the height A [µm] of the first the solder bump and the height B [µm] of the above-described protruded electrode is substantially equivalent to the thickness C [µm] of the above-described adhesive agent layer.