发明公开
EP2274162A1 ASSEMBLIES AND METHODS FOR REDUCING WARP AND BOW OF A FLEXIBLE SUBSTRATE DURING SEMICONDUCTOR PROCESSING
审中-公开
ARRANGEMENTS AND METHOD FOR REDUCING弯曲翘曲和柔性衬底在半导体处理期间
- 专利标题： ASSEMBLIES AND METHODS FOR REDUCING WARP AND BOW OF A FLEXIBLE SUBSTRATE DURING SEMICONDUCTOR PROCESSING
- 专利标题（中）： ARRANGEMENTS AND METHOD FOR REDUCING弯曲翘曲和柔性衬底在半导体处理期间
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申请号： EP09729456.5申请日： 2009-04-06
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公开(公告)号： EP2274162A1公开(公告)日： 2011-01-19
- 发明人: O'ROURKE, Shawn , LOY, Douglas , JIANG, Hanqing
- 申请人： The Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University
- 申请人地址： 1475 North Scottsdale Road SkySong Suite 200 Scottsdale, AZ 85257-9908 US
- 专利权人： The Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University
- 当前专利权人： The Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University
- 当前专利权人地址： 1475 North Scottsdale Road SkySong Suite 200 Scottsdale, AZ 85257-9908 US
- 代理机构： Zwicker, Jörk
- 优先权： US43223 20080408
- 国际公布： WO2009126544 20091015
- 主分类号： B32B7/12
- IPC分类号： B32B7/12 ; B32B15/08 ; B32B27/36 ; H01L23/498 ; H05K3/00
摘要：
Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.
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