发明公开
- 专利标题： WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- 专利标题（中）： 接线板及其制造方法
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申请号： EP09732413.1申请日： 2009-04-06
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公开(公告)号： EP2274962A1公开(公告)日： 2011-01-19
- 发明人: PALM, Petteri , KUJALA, Arni
- 申请人： Imbera Electronics Oy
- 申请人地址： Ruukintie 2 02330 Espoo FI
- 专利权人： Imbera Electronics Oy
- 当前专利权人： Imbera Electronics Oy
- 当前专利权人地址： Ruukintie 2 02330 Espoo FI
- 代理机构： Helino, Timo Kalervo
- 优先权： FI20085332 20080418
- 国际公布： WO2009127780 20091022
- 主分类号： H05K3/00
- IPC分类号： H05K3/00 ; H01L23/31
摘要：
A method for manufacturing a wiring board, comprising the steps of mounting at least one structural aid on each side of a planar temporary bonding means, arranging a slot from the at least one structural aid on each side of the planar temporary bonding means, embedding the electrical component in the slot, such that the terminals of the electrical component face away from the planar temporary bonding means, mounting at least one electrical component on a component foil, such that the terminals of the electrical component face the component foil, mounting the component foil at least partially on the at least one structural aid, on each side of the planar temporary bonding means.
公开/授权文献
- EP2274962B1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 公开/授权日：2018-07-11
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