公开(公告)号：EP2274962A1

公开(公告)日：2011-01-19

申请号：EP09732413.1

申请日：2009-04-06

申请人： Imbera Electronics Oy

发明人： PALM, Petteri ,  KUJALA, Arni

IPC分类号： H05K3/00 ,  H01L23/31

CPC分类号： H05K1/185 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L24/19 ,  H01L24/90 ,  H01L25/0652 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/2919 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/90 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/18162 ,  H05K1/188 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/10674 ,  H05K2203/1469 ,  H05K2203/1536 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/0665 ,  H01L2924/00

摘要： A method for manufacturing a wiring board, comprising the steps of mounting at least one structural aid on each side of a planar temporary bonding means, arranging a slot from the at least one structural aid on each side of the planar temporary bonding means, embedding the electrical component in the slot, such that the terminals of the electrical component face away from the planar temporary bonding means, mounting at least one electrical component on a component foil, such that the terminals of the electrical component face the component foil, mounting the component foil at least partially on the at least one structural aid, on each side of the planar temporary bonding means.

摘要翻译： 一种用于制造接线板的方法，包括以下步骤：在平面临时接合装置（2）的每一侧上安装至少一个结构辅助件（10），从所述至少一个结构辅助件（10）布置狭槽（3） 在所述平面临时接合装置（2）的每一侧上，将所述电气部件（4）嵌入所述狭槽（3）中，使得所述电气部件（4）的接线端（6）背离所述平面临时接合装置 （5）上安装至少一个电气元件（4），使得电气元件（4）的端子（6）面向元件薄片（5），将元件薄片（5）安装在 至少部分地在所述至少一个结构辅助件（10）上，在所述平面临时接合装置（2）的每一侧上。

公开(公告)号：EP1997360A1

公开(公告)日：2008-12-03

申请号：EP07730634.8

申请日：2007-03-15

申请人： Imbera Electronics Oy

发明人： TUOMINEN, Risto ,  PALM, Petteri ,  IIHOLA, Antti

IPC分类号： H05K1/18

CPC分类号： H05K3/10 ,  F02M53/02 ,  F02M53/06 ,  F02M55/02 ,  F02M55/025 ,  F02M69/465 ,  H01L21/56 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/24137 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H05K1/02 ,  H05K1/185 ,  H05K3/108 ,  H05K3/181 ,  H05K2203/0156 ,  H05K2203/1469 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： A method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing an intermediate product, which contains the insulator layer of the circuit board and the components, which are set in place inside the insulator layer in such a way that the contact elements of the components face the surface of the intermediate product. After this, the intermediate product is transferred to the circuit-board manufacturing line, on which a suitable number of conductor-pattern layers and, if necessary, insulator layers are manufactured on one or both sides of the intermediate product, in such a way that, when manufacturing the first conductor-pattern layer, the conductor material forms an electrical contact with the contact elements of the components. Alternatively, stages can also be performed on a single manufacturing line.

公开(公告)号：EP1609339A1

公开(公告)日：2005-12-28

申请号：EP04724626.9

申请日：2004-03-31

申请人： Imbera Electronics Oy

发明人： TUOMINEN, Risto ,  PALM, Petteri

IPC分类号： H05K1/18 ,  H05K3/46

CPC分类号： H01L23/544 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/0652 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/32245 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/3025 ,  H05K1/188 ,  H05K3/4611 ,  H01L2924/00

摘要： This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.

公开(公告)号：EP1597946A1

公开(公告)日：2005-11-23

申请号：EP04714344.1

申请日：2004-02-25

申请人： Imbera Electronics Oy

发明人： TUOMINEN, Risto ,  PALM, Petteri

IPC分类号： H05K1/18 ,  H01L21/70

CPC分类号： H01L25/50 ,  H01L24/19 ,  H01L25/105 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/3025 ,  H05K1/188 ,  H05K3/4611

摘要： This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is attached to the surface of a conductive layer and electrical and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the component (6) is attached.

公开(公告)号：EP1609339B1

公开(公告)日：2011-10-26

申请号：EP04724626.9

申请日：2004-03-31

申请人： Imbera Electronics Oy

发明人： TUOMINEN, Risto ,  PALM, Petteri

IPC分类号： H05K1/18 ,  H05K3/46

CPC分类号： H01L23/544 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/0652 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/32245 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/3025 ,  H05K1/188 ,  H05K3/4611 ,  H01L2924/00

摘要： This publication discloses an electronic module and a method for manufacturing an electronic module, in which a component (6) is glued (5) to the surface of a conductive layer, from which conductive layer conductive patterns (14) are later formed. After gluing the component (6), an insulating-material layer (1), which surrounds the component (6) attached to the conductive layer, is formed on, or attached to the surface of the conductive layer. After the gluing of the component (6), feed-throughs are also made, through which electrical contacts can be made between the conductive layer and the contact zones (7) of the component. After this, conductive patterns (14) are made from the conductive layer, to the surface of which the component (6) is glued.

公开(公告)号：EP1597947A1

公开(公告)日：2005-11-23

申请号：EP04714345.8

申请日：2004-02-25

申请人： Imbera Electronics Oy

发明人： TUOMINEN, Risto ,  PALM, Petteri

IPC分类号： H05K1/18 ,  H01L21/60

CPC分类号： H05K1/188 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/4611 ,  H05K3/4691 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169 ,  H01L2924/00

摘要： An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component (6). The component (6) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the component (6) is attached.

公开(公告)号：EP1597947B1

公开(公告)日：2011-09-14

申请号：EP04714345.8

申请日：2004-02-25

申请人： Imbera Electronics Oy

发明人： TUOMINEN, Risto ,  PALM, Petteri

IPC分类号： H05K1/18 ,  H01L21/60

CPC分类号： H05K1/188 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/4611 ,  H05K3/4691 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169 ,  H01L2924/00

摘要： An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component (6). The component (6) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the component (6) is attached.

公开(公告)号：EP1891843A1

公开(公告)日：2008-02-27

申请号：EP06764434.4

申请日：2006-06-15

申请人： Imbera Electronics Oy

发明人： TUOMINEN, Risto ,  IIHOLA, Antti ,  PALM, Petteri

IPC分类号： H05K1/00 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H05K1/183 ,  H05K1/186 ,  H05K1/187 ,  H05K3/0017 ,  H05K3/20 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/423 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2203/0554 ,  H05K2203/0733 ,  H05K2203/1438 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49158 ,  H01L2924/00

摘要： This publication discloses a method for manufacturing a circuit-board structure. According to the method, a conductor pattern (13) is made, and contact openings are made in it for a component's (16) electrical contacts. After this, the component (16) is attached relative to the conductor pattern (13), in such a way that the contact areas or contact bumps of the component lie next to the contact openings. After this, an electrically conductive material is introduced to the contact openings, in order to form electrical contacts between the conductor pattern (13) and the component (16).

公开(公告)号：EP1891845B1

公开(公告)日：2016-08-10

申请号：EP06764433.6

申请日：2006-06-15

申请人： Imbera Electronics Oy

发明人： IIHOLA, Antti ,  TUOMINEN, Risto ,  PALM, Petteri

IPC分类号： H05K3/20 ,  H01L21/48

CPC分类号： H05K3/064 ,  H01L21/4846 ,  H01L21/56 ,  H01L21/568 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81121 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K1/187 ,  H05K1/188 ,  H05K3/205 ,  H05K3/284 ,  H05K3/303 ,  H05K3/305 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0353 ,  H05K2203/063 ,  H05K2203/0723 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2224/29075 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and at least some conductor material of the conductor layer is removed from outside the conductor pattern.

摘要翻译： 本公开公开了一种制造电路板结构的方法。 在该方法中，制造导体层，该导体层包括在导体箔的表面上的导体箔和导体图案。 一个部件附着在导体层上，并且导体层被薄化，使得导体层的导体材料从导体图案的外面去除。

公开(公告)号：EP1891845A2

公开(公告)日：2008-02-27

申请号：EP06764433.6

申请日：2006-06-15

申请人： Imbera Electronics Oy

发明人： IIHOLA, Antti ,  TUOMINEN, Risto ,  PALM, Petteri

IPC分类号： H05K3/20 ,  H01L21/48

CPC分类号： H05K3/064 ,  H01L21/4846 ,  H01L21/56 ,  H01L21/568 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81121 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K1/187 ,  H05K1/188 ,  H05K3/205 ,  H05K3/284 ,  H05K3/303 ,  H05K3/305 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0353 ,  H05K2203/063 ,  H05K2203/0723 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2224/29075 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and at least some conductor material of the conductor layer is removed from outside the conductor pattern.